Telefonaktiebolaget lm ericsson (publ) (20240349455). PHASE CHANGE HEATSINK, MANUFACTURING PROCESS THEREOF, AND COMMUNICATION DEVICE HAVING THE HEATSINK simplified abstract
Contents
PHASE CHANGE HEATSINK, MANUFACTURING PROCESS THEREOF, AND COMMUNICATION DEVICE HAVING THE HEATSINK
Organization Name
telefonaktiebolaget lm ericsson (publ)
Inventor(s)
PHASE CHANGE HEATSINK, MANUFACTURING PROCESS THEREOF, AND COMMUNICATION DEVICE HAVING THE HEATSINK - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240349455 titled 'PHASE CHANGE HEATSINK, MANUFACTURING PROCESS THEREOF, AND COMMUNICATION DEVICE HAVING THE HEATSINK
Simplified Explanation: The patent application describes a phase change heatsink for a communication device, which includes a heatsink base and a phase change heat spreader integrated into the base. The process for manufacturing the heatsink involves die-casting the base, attaching a cover to enclose a cavity, and filling it with refrigerant.
- Heatsink base with integrated phase change heat spreader
- Process involves die-casting, attaching cover, and filling with refrigerant
- Support pillars extend from base to cover in the enclosed cavity
Potential Applications: 1. Cooling systems for communication devices 2. Electronic devices requiring efficient heat dissipation
Problems Solved: 1. Overheating in communication devices 2. Inefficient heat dissipation in electronic devices
Benefits: 1. Improved cooling efficiency 2. Enhanced performance and longevity of electronic devices
Commercial Applications: The phase change heatsink technology can be utilized in smartphones, laptops, servers, and other electronic devices to ensure optimal thermal management, leading to better overall performance and reliability in the market.
Prior Art: Readers interested in prior art related to phase change heatsinks can explore research papers, patents, and technical articles in the field of thermal management and heat dissipation technologies.
Frequently Updated Research: Stay updated on the latest advancements in phase change heatsink technology by following research publications and industry developments in the field of thermal management and electronic cooling systems.
Questions about Phase Change Heatsinks: 1. What are the key advantages of using a phase change heatsink in electronic devices? 2. How does the integration of a phase change heat spreader improve the cooling efficiency of a heatsink?
Original Abstract Submitted
a phase change heatsink, a process for manufacturing the heatsink, and a communication device having the heatsink are disclosed. the phase change heatsink includes a heatsink base and a phase change heat spreader integrated into the heatsink base. the phase change heat spreader includes a cover attached to the heatsink base and defines an enclosed cavity, in which one or more support pillars are provided in the enclosed cavity to extend from the heatsink base to the cover, and which is partially filled with refrigerant. the process comprises steps of: a) die-casting the heatsink base to shape the cavity and the support pillars; b) attaching the cover to the heatsink base to enclose the cavity; and c) filling a certain amount of refrigerant into the cavity through a filling port, and scaling the filling port. the attaching step b) further comprises a step b1) of sealing a periphery of the cover to the heatsink base, and a step b2) of bonding a central portion of the cover to the support pillars.
