18580211. DISPLAY DEVICE AND PREPARATION METHOD THEREFOR simplified abstract (BOE Technology Group Co., Ltd.)
Contents
DISPLAY DEVICE AND PREPARATION METHOD THEREFOR
Organization Name
BOE Technology Group Co., Ltd.
Inventor(s)
DISPLAY DEVICE AND PREPARATION METHOD THEREFOR - A simplified explanation of the abstract
This abstract first appeared for US patent application 18580211 titled 'DISPLAY DEVICE AND PREPARATION METHOD THEREFOR
Simplified Explanation: The patent application describes a display device and its manufacturing method that improve bonding precision between the chip packaging unit and the display panel, increasing the output channels of the chip packaging unit for high-resolution display products.
Key Features and Innovation:
- Chip packaging component includes at least one chip packaging unit with a flexible base, a rigid base, and a lead layer.
- Lead layer contains multiple first leads, enhancing the bonding precision between components.
- Orthographic projections of leads on the flexible base are within the projection of the rigid base, ensuring alignment.
Potential Applications: This technology can be applied in the manufacturing of high-resolution display products, such as TVs, monitors, and smartphones.
Problems Solved: The technology addresses the need for increased bonding precision in chip packaging units for high-resolution displays, meeting the requirements of modern display products.
Benefits:
- Improved bonding precision
- Increased output channels
- Enhanced display quality
Commercial Applications: The technology can be utilized in the production of various high-resolution display devices, catering to the demand for advanced visual technology in consumer electronics.
Prior Art: Readers interested in prior art related to this technology can explore patents and research papers in the field of display device manufacturing and chip packaging.
Frequently Updated Research: Stay updated on advancements in display technology, chip packaging methods, and bonding techniques to enhance the efficiency and quality of display devices.
Questions about Display Device Technology: 1. How does this technology improve the bonding precision between chip packaging units and display panels? 2. What are the potential applications of this technology in the consumer electronics market?
Original Abstract Submitted
A display device and a manufacturing method therefor are provided by the present application. The display devices can greatly increase the bonding precision of the chip packaging unit and the display panel, thereby the quantity of the output channels of chip packaging unit are greatly increased, thus the requirements of the high-resolution display products are satisfied. A chip packaging component is formed, wherein the chip packaging component includes at least one chip packaging unit; and the chip packaging unit includes at least a flexible base, a rigid base disposed at one side of the flexible base, and a lead layer disposed at one side of the flexible base away from the rigid base, lead layer includes at least a plurality of first leads, and orthographic projections of the plurality of first leads on the flexible base are located within an orthographic projection of rigid base on the flexible base.
