18749794. LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SUBSTRATE, AND DISPLAY DEVICE simplified abstract (BOE Technology Group Co., Ltd.)
Contents
LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SUBSTRATE, AND DISPLAY DEVICE
Organization Name
BOE Technology Group Co., Ltd.
Inventor(s)
LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SUBSTRATE, AND DISPLAY DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18749794 titled 'LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SUBSTRATE, AND DISPLAY DEVICE
Simplified Explanation:
The patent application describes a light-emitting substrate with two substrates facing each other and a bonding wire structure connecting them. The bonding wire is soldered to conductive pads on each substrate, forming solder joints with angled or curved portions.
- The patent application involves a light-emitting substrate with a unique bonding wire structure.
- The substrate consists of two opposite substrates with conductive pads.
- A bonding wire connects the substrates through solder joints with angled or curved portions.
Key Features and Innovation:
- Novel bonding wire structure for light-emitting substrates.
- Use of solder joints with angled or curved portions for enhanced connectivity.
- Integration of conductive pads on opposite substrates for efficient light emission.
Potential Applications:
The technology can be applied in:
- LED displays
- Automotive lighting systems
- Backlit signage
Problems Solved:
- Improved connectivity between substrates
- Enhanced light emission efficiency
- Reduced risk of disconnection or malfunction
Benefits:
- Enhanced durability and reliability of light-emitting substrates
- Improved performance of LED displays and lighting systems
- Cost-effective manufacturing process
Commercial Applications:
Title: Innovative Bonding Wire Structure for Light-Emitting Substrates
The technology can be utilized in various commercial applications such as:
- LED display manufacturing companies
- Automotive lighting industry
- Signage and advertising companies
Prior Art:
Readers can explore prior research on bonding wire structures in light-emitting devices to understand the evolution of this technology.
Frequently Updated Research:
Stay updated on the latest advancements in bonding wire structures for light-emitting substrates to ensure the most current information is utilized.
Questions about Light-Emitting Substrates: 1. How does the bonding wire structure impact the overall performance of light-emitting substrates? 2. What are the potential challenges in implementing this technology in large-scale manufacturing processes?
Original Abstract Submitted
A light-emitting substrate is provided, including first and second substrates opposite to each other, and a bonding wire structure including a bonding wire. The first substrate includes: a first base substrate and a first conductive pad. The second substrate includes a second base substrate and a second conductive pad. The first conductive pad is on a surface of the first substrate away from the second substrate, the second conductive pad is on a surface of the second substrate away from the first substrate. The bonding wire is soldered to the first conductive pad at a first solder joint and to the second conductive pad at a second solder joint. The bonding wire includes, at each of the first solder joint and the second solder joint, a portion having an angle with a plane where the first base substrate is located and/or having a curved arc.
