Sony group corporation (20240349422). COPPER CLAD LAMINATE AND PRINTED WIRING BOARD simplified abstract
Contents
COPPER CLAD LAMINATE AND PRINTED WIRING BOARD
Organization Name
Inventor(s)
Fumikatsu Uesawa of Tokyo (JP)
Yoshiyuki Nomura of Tokyo (JP)
COPPER CLAD LAMINATE AND PRINTED WIRING BOARD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240349422 titled 'COPPER CLAD LAMINATE AND PRINTED WIRING BOARD
The patent application describes a copper clad laminate with a biodegradable resin substrate that is less likely to warp or crack.
- Resin substrate containing at least 50% polylactic acid
- Degree of crystallization of polylactic acid between 29% and 36%
- Crystallite size of polylactic acid between 19 nm and 26 nm
- Adhesive layer and copper foil layer stacked on resin substrate
- Printed wiring board formed using the copper clad laminate
Potential Applications: - Electronic devices - Green technology initiatives - Sustainable manufacturing processes
Problems Solved: - Reduced environmental impact of electronic manufacturing - Improved durability and stability of copper clad laminates
Benefits: - Biodegradability of resin substrate - Decreased likelihood of warping or cracking - Enhanced performance of printed wiring boards
Commercial Applications: Title: Sustainable Copper Clad Laminates for Electronics Manufacturing Description: This technology can be used in the production of electronic devices, promoting sustainability and reducing environmental impact. It can also appeal to consumers looking for eco-friendly products.
Questions about Sustainable Copper Clad Laminates: 1. How does the use of polylactic acid in the resin substrate contribute to the biodegradability of the laminate? 2. What are the potential cost implications of using this innovative material in electronic manufacturing processes?
Frequently Updated Research: Ongoing studies may focus on optimizing the composition of the resin substrate for improved performance and sustainability in electronic applications.
Original Abstract Submitted
an object of the present technology is to provide a copper clad laminate including a resin substrate that has biodegradability and less likely to warp or crack. the present technology provides a copper clad laminate including: a resin substrate; an adhesive layer; and a copper foil layer, the adhesive layer and the copper foil layer being stacked in this order on at least one side of the resin substrate, the resin substrate containing at least 50 mass % or more of polylactic acid, the degree of crystallization of the polylactic acid calculated on a basis of a result of differential scanning calorimetry being 29% or more and 36% or less, a crystallite size of the polylactic acid calculated on a basis of a result of x-ray diffraction measurement being 19 nm or more and 26 nm or less. further, the present technology provides a printed wiring board formed using the copper clad laminate.
