Lg electronics inc. (20240343027). COMPOSITE POLYIMIDE SUBSTRATE, COMPOSITE POLYIMIDE COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME simplified abstract
COMPOSITE POLYIMIDE SUBSTRATE, COMPOSITE POLYIMIDE COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME
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COMPOSITE POLYIMIDE SUBSTRATE, COMPOSITE POLYIMIDE COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240343027 titled 'COMPOSITE POLYIMIDE SUBSTRATE, COMPOSITE POLYIMIDE COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME
The present invention is applicable in the field of substrates for high-frequency circuits, specifically a composite polyimide substrate, a composite polyimide composition, and a printed circuit board using the same. The composite polyimide substrate includes a substrate main body with a polyimide partially substituted with a polyester group, along with polytetrafluoroethylene (PTFE) particles.
- Composite polyimide substrate for high-frequency circuits
- Substrate main body with polyimide partially substituted with a polyester group
- Inclusion of polytetrafluoroethylene (PTFE) particles in the substrate
- Enhanced performance and reliability for high-frequency circuits
- Potential for improved signal transmission and reduced signal loss
Potential Applications: - High-frequency circuit boards - Aerospace and defense electronics - Telecommunications equipment - Medical devices - Automotive electronics
Problems Solved: - Signal loss in high-frequency circuits - Thermal stability in demanding environments - Improved reliability and performance of electronic devices
Benefits: - Enhanced signal transmission - Increased durability and reliability - Improved thermal stability - Potential for miniaturization of electronic devices - Cost-effective manufacturing process
Commercial Applications: The composite polyimide substrate can be used in the production of high-frequency circuit boards for various industries, including aerospace, telecommunications, medical, and automotive sectors. Its improved performance and reliability make it a valuable component in electronic devices requiring high-frequency signal transmission.
Questions about Composite Polyimide Substrate: 1. How does the inclusion of PTFE particles enhance the performance of the substrate? 2. What are the potential cost savings associated with using this composite polyimide substrate in electronic devices?
Frequently Updated Research: Ongoing research focuses on further optimizing the composition of the polyimide substrate to improve its electrical and mechanical properties for high-frequency applications. Researchers are also exploring new methods of integrating PTFE particles to enhance signal transmission efficiency.
Original Abstract Submitted
the present invention is applicable in the field of substrates for high-frequency circuits, and for example, relates to a composite polyimide substrate, a composite polyimide composition, and a printed circuit board using same. the composite polyimide substrate according to the present invention may include: a substrate main body including a polyimide of which at least a portion has been substituted with a polyester group; and polytetrafluoroethylene (ptfe) particles included in the substrate main body.
