Boe technology group co., ltd. (20240347550). DRIVING BACKPLANE AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS simplified abstract
Contents
DRIVING BACKPLANE AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS
Organization Name
boe technology group co., ltd.
Inventor(s)
DRIVING BACKPLANE AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240347550 titled 'DRIVING BACKPLANE AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS
The abstract describes a method for preparing a driving backplane, involving several steps such as forming a connecting layer, insulating layer group, inducing particles, doped amorphous silicon layer, and conductor parts.
- Providing a base substrate
- Forming a connecting layer on one side of the base substrate
- Forming an insulating layer group on the connecting layer
- Patterning the insulating layer group to create a first via hole
- Introducing inducing particles on the insulating layer group
- Creating a doped amorphous silicon layer on the inducing particles
- Forming a first conductor part in the first via hole
- Patterning the doped amorphous silicon layer to create a raw material part
- Inducing the raw material part with the inducing particles to form a first channel part
Potential Applications: - This technology can be used in the manufacturing of display panels, sensors, and other electronic devices requiring a driving backplane.
Problems Solved: - Provides a method for efficiently preparing a driving backplane with improved conductivity and performance.
Benefits: - Enhanced conductivity and performance of the driving backplane - Cost-effective manufacturing process
Commercial Applications: - Display panel manufacturing industry - Electronics manufacturing sector
Questions about the technology: 1. How does the method of inducing particles contribute to the performance of the driving backplane? 2. What are the advantages of using a doped amorphous silicon layer in this process?
Original Abstract Submitted
a method for preparing a driving backplane includes: providing a base substrate, forming a connecting layer on a side of the base substrate; forming an insulating layer group on a side of the connecting layer away from the base substrate, forming a first via hole by patterning the insulating layer group; forming inducing particles on a side of the insulating layer group away from the base substrate; forming a doped amorphous silicon layer on a side of the inducing particles away from the base substrate, forming a first conductor part by the doped amorphous silicon layer formed in the first via hole, forming a raw material part by patterning the doped amorphous silicon layer; and forming a first channel part by causing the inducing particles to induce the raw material part, wherein the first channel part is connected to the first conductor part.
