SEMICONDUCTOR PACKAGE WITH PROTECTIVE MOLD

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SEMICONDUCTOR PACKAGE WITH PROTECTIVE MOLD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18748228 titled 'SEMICONDUCTOR PACKAGE WITH PROTECTIVE MOLD

Simplified Explanation: The method described in the patent application involves fabricating a semiconductor package by partially cutting a wafer to form a transparent substrate, mounting an image sensor chip on the substrate, and forming a mold layer over the substrate and chip.

The method includes partially cutting a wafer to create a transparent substrate with different parts.
An image sensor chip is mounted on the transparent substrate.
The image sensor chip features a redistribution insulation layer, redistribution layer, substrate layer, and penetration electrode.
A mold layer is formed over the transparent substrate and the image sensor chip.
Connection terminals are added to the image sensor chip.
The transparent substrate and mold layer are cut along the boundary of the unit wafer.

Potential Applications: This technology can be used in the manufacturing of semiconductor packages for various electronic devices such as cameras, smartphones, and other imaging devices.

Problems Solved: This method addresses the need for efficient and precise fabrication of semiconductor packages with image sensor chips.

Benefits: The benefits of this technology include improved manufacturing processes, enhanced performance of electronic devices, and potentially reduced production costs.

Commercial Applications: The commercial applications of this technology include the production of high-quality image sensors for consumer electronics, medical devices, and automotive applications.

Prior Art: Prior art related to this technology may include existing methods for fabricating semiconductor packages and mounting image sensor chips on substrates.

Frequently Updated Research: Researchers may be exploring advancements in image sensor technology, semiconductor packaging techniques, and materials used in the fabrication process.

Questions about Semiconductor Package Fabrication: 1. How does this method improve the efficiency of semiconductor package fabrication? 2. What are the potential cost savings associated with using this technology in manufacturing processes?

Original Abstract Submitted

Provided is a method for fabricating a semiconductor package. The method includes partially cutting a wafer along a boundary of a unit wafer to form a transparent substrate including a first part having a first width and a second part and mounting an image sensor chip on the second part of the transparent substrate. The image sensor chip includes a redistribution insulation layer, a redistribution layer in the redistribution insulation layer, a first substrate layer on the redistribution insulation layer, and a penetration electrode penetrating the first substrate layer and electrically connecting the redistribution layer. The method further includes forming a mold layer on the transparent substrate, covering side surfaces of the second part and side surfaces of the image sensor chip, forming a connection terminal on the image sensor chip, and cutting the transparent substrate and the mold layer along the boundary of the unit wafer.