Samsung electronics co., ltd. (20240348907). CAMERA MODULE AND ELECTRONIC DEVICE COMPRISING CAMERA MODULE simplified abstract

CAMERA MODULE AND ELECTRONIC DEVICE COMPRISING CAMERA MODULE

Organization Name

samsung electronics co., ltd.

Inventor(s)

Hyosang An of Suwon-si (KR)

Hwajoong Jung of Suwon-si (KR)

Beomsik Kim of Suwon-si (KR)

Bongchan Kim of Suwon-si (KR)

Taehwan Kim of Suwon-si (KR)

Hyungjin Rho of Suwon-si, Gyeonggi-do (KR)

Jaeheung Park of Suwon-si (KR)

Kwangseok Byon of Suwon-si (KR)

Jonghoon Won of Suwon-si (KR)

CAMERA MODULE AND ELECTRONIC DEVICE COMPRISING CAMERA MODULE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240348907 titled 'CAMERA MODULE AND ELECTRONIC DEVICE COMPRISING CAMERA MODULE

The camera module described in the patent application includes an image sensor, a substrate connected to the image sensor, a bracket fixing the substrate, and a plate shielding the image sensor from the outside.

• The image sensor is a key component of the camera module.
• The substrate is electrically connected to the image sensor.
• The bracket is designed to secure the substrate in place.
• The plate shields the image sensor from external elements.
• The bracket is formed through injection molding with the plate inserted into the mold.

Potential Applications: - Mobile phones - Digital cameras - Surveillance systems - Automotive cameras - Drones

Problems Solved: - Protecting the image sensor from damage - Ensuring proper functioning of the camera module - Shielding sensitive components from external factors

Benefits: - Improved durability and longevity of the camera module - Enhanced image quality and performance - Increased reliability in various applications

Commercial Applications: The technology can be used in various consumer electronics, security systems, and industrial equipment to enhance imaging capabilities and ensure reliable performance.

Questions about the technology: 1. How does the bracket contribute to the overall protection of the image sensor? 2. What are the advantages of using injection molding for the bracket in this camera module?

Frequently Updated Research: Stay updated on advancements in image sensor technology, injection molding techniques, and camera module design to further enhance the functionality and performance of the patented technology.

Original Abstract Submitted

a camera module according to various embodiments of the disclosure may include: an image sensor (); a substrate () electrically connected to the image sensor (); a bracket () configured to fix the substrate (); and a plate () disposed on the bracket () such that the width () of a surface of the plate () facing the image sensor () includes the width () of an area in which the image sensor () is disposed, thereby shielding at least a part of a space in which the image sensor () is disposed from the outside, wherein the bracket () may be formed by injection molding a material forming the bracket () in a state in which the plate () is inserted into a mold. various other embodiments inferable from the specification are also possible