Samsung electronics co., ltd. (20240347510). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Byeongchan Kim of Suwon-si (KR)
Unbyoung Kang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240347510 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of two semiconductor chips stacked on top of each other. The first chip has through electrodes, bonding pads, a passivation layer, and a polishing stop layer with bonding pads. The second chip has bonding pads and a passivation layer.
- The first semiconductor chip includes through electrodes, bonding pads, and passivation layers.
- The second semiconductor chip has bonding pads and a passivation layer.
- The bonding pads of the first and second chips are directly bonded to each other.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor packages for various electronic devices. - It can improve the performance and reliability of stacked semiconductor chips in compact electronic products.
Problems Solved: - Enhances the bonding process between stacked semiconductor chips. - Improves the overall functionality and efficiency of semiconductor packages.
Benefits: - Increased reliability and performance of electronic devices. - Enhanced compactness and efficiency of semiconductor packages.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Device Performance This technology can be utilized in the production of smartphones, tablets, laptops, and other electronic devices requiring compact and high-performance semiconductor packages. The market implications include improved product quality, increased consumer satisfaction, and potential cost savings for manufacturers.
Prior Art: Readers can explore prior art related to semiconductor packaging technologies, bonding processes, and stacked chip configurations to gain a deeper understanding of the innovation presented in this patent application.
Frequently Updated Research: Researchers in the semiconductor industry may be conducting studies on advanced packaging techniques, bonding materials, and chip stacking methods to further enhance the performance and reliability of electronic devices. Stay updated on the latest developments in semiconductor packaging technology to leverage cutting-edge innovations in product design and manufacturing.
Questions about Semiconductor Packaging Technology: 1. How does this technology improve the bonding process between stacked semiconductor chips? 2. What are the potential applications of this advanced semiconductor packaging technology in the consumer electronics industry?
Original Abstract Submitted
a semiconductor package includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. the first semiconductor chip includes a plurality of through electrodes, first bonding pads provided on a first surface of a first substrate, a first passivation layer provided on the first surface and exposing the first bonding pads, a polishing stop layer pattern provided on a second surface of the first substrate and exposing end portions of the plurality of through electrodes, and second bonding pads provided on the polishing stop layer pattern. the second semiconductor chip includes third bonding pads provided on a first surface of a second substrate, and a second passivation layer provided on the first surface of the second substrate and exposing the third bonding pads. the first bonding pads and the third bonding pads are directly bonded to each other.
