Samsung electronics co., ltd. (20240347508). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240347508 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract consists of a lower redistribution wiring layer, an encapsulation structure, conductive bumps, and an adhesive layer.
- The encapsulation structure includes a core substrate with a cavity for at least one semiconductor chip, positioned so that the chip pads face the lower redistribution wiring layer.
- An upper redistribution wiring layer covers the upper surface of the core substrate and is electrically connected to the conductive structures of the core substrate.
- Key Features and Innovation:**
- Integration of semiconductor chips within an encapsulation structure with redistribution wiring layers for enhanced electrical connectivity.
- Use of conductive bumps and adhesive layers to secure the semiconductor package components in place.
- Potential Applications:**
- This technology can be applied in various electronic devices such as smartphones, tablets, and computers.
- It can also be used in automotive electronics, medical devices, and industrial equipment.
- Problems Solved:**
- Provides a compact and efficient way to package semiconductor chips with improved electrical connections.
- Ensures secure attachment of components within the package for reliable performance.
- Benefits:**
- Enhanced electrical connectivity between semiconductor chips and external components.
- Compact design for space-saving in electronic devices.
- Improved reliability and performance of semiconductor packages.
- Commercial Applications:**
Potential commercial applications include the manufacturing of consumer electronics, automotive electronics, medical devices, and industrial equipment. This technology can be utilized by semiconductor companies, electronics manufacturers, and other industries requiring compact and reliable semiconductor packaging solutions.
- Questions about Semiconductor Package Technology:**
1. How does the integration of semiconductor chips within an encapsulation structure improve electrical connectivity? 2. What are the potential challenges in implementing this technology in various electronic devices?
Original Abstract Submitted
a semiconductor package includes a lower redistribution wiring layer having lower redistribution wirings; an encapsulation structure on the lower redistribution wiring layer; a plurality of conductive bumps between the lower redistribution wiring layer and the encapsulation structure; and an adhesive layer attaching the lower redistribution wiring layer and the encapsulation structure. the encapsulation structure includes a core substrate having a cavity formed therein, at least one semiconductor chip in the cavity such that a front surface on which chip pads are formed faces the lower redistribution wiring layer, and an upper redistribution wiring layer covering an upper surface of the core substrate and having upper redistribution wiring layers that are electrically connected to conductive structures of the core substrate.
