Samsung electronics co., ltd. (20240347499). SEMICONDUCTOR PACKAGE simplified abstract
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SEMICONDUCTOR PACKAGE
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SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240347499 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a package substrate with a power pad and a ground pad spaced apart in one direction, two semiconductor chips stacked in a stepped shape in a perpendicular direction, and connection wires linking the substrate to the chips.
- The first semiconductor chip has lower option pads, while the second chip has upper option pads.
- Connection wires include a conductive wire connecting upper chip pads of the second chip to lower option pads of the first chip.
Potential Applications: - This technology could be used in various electronic devices requiring efficient power distribution and signal transmission. - It may find applications in consumer electronics, telecommunications equipment, and automotive systems.
Problems Solved: - Enables compact design of semiconductor packages with improved electrical connections. - Facilitates efficient heat dissipation and signal integrity in stacked chip configurations.
Benefits: - Enhanced performance and reliability of electronic devices. - Cost-effective manufacturing of semiconductor packages with optimized space utilization.
Commercial Applications: - The technology could be valuable for semiconductor manufacturers looking to enhance the functionality and efficiency of their products. - It may have significant market implications in industries such as IoT, 5G communication, and automotive electronics.
Questions about the Technology: 1. How does the stepped shape of the stacked semiconductor chips contribute to the overall performance of the package? 2. What are the specific advantages of using upper and lower option pads in the semiconductor chips?
Frequently Updated Research: - Stay updated on advancements in semiconductor packaging technologies, particularly in the area of stacked chip configurations and interconnection methods.
Original Abstract Submitted
a semiconductor package includes a package substrate including a power pad and a ground pad that are spaced apart from each other in a first horizontal direction, first and second semiconductor chips on the package substrate, the first and second semiconductor chips being stacked in a stepped shape that extends in a second horizontal direction perpendicular to the first horizontal direction, and a plurality of connection wires that electrically connect the package substrate to the first semiconductor chip and/or the second semiconductor chip. the first semiconductor chip includes a plurality of lower option pads. the second semiconductor chip includes a plurality of upper option pads. the plurality of connection wires include a conductive wire that electrically connects at least one of first and second upper chip pads of the second semiconductor chip to at least one of the lower option pads of the first semiconductor chip.
