Intel corporation (20240347590). METHODS AND APPARATUS TO REDUCE STRESS IN INTEGRATED CIRCUIT PACKAGES simplified abstract

METHODS AND APPARATUS TO REDUCE STRESS IN INTEGRATED CIRCUIT PACKAGES

Organization Name

intel corporation

Inventor(s)

Bhaskar Jyoti Krishnatreya of Hillsboro OR (US)

Guruprasad Arakere of Chandler AZ (US)

Nitin Ashok Deshpande of Chandler AZ (US)

Mohammad Enamul Kabir of Portland OR (US)

Omkar Gopalkrishna Karhade of Chandler AZ (US)

Keith Edward Zawadzki of Portland OR (US)

Trianggono S. Widodo of Hillsboro OR (US)

METHODS AND APPARATUS TO REDUCE STRESS IN INTEGRATED CIRCUIT PACKAGES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240347590 titled 'METHODS AND APPARATUS TO REDUCE STRESS IN INTEGRATED CIRCUIT PACKAGES

The abstract of the patent application describes systems, apparatus, articles of manufacture, and methods to reduce stress in integrated circuit packages. An example semiconductor chip includes a front surface, a back surface, a first lateral surface, a second lateral surface, and a curved fillet at an intersection between the first and second lateral surfaces.

• The semiconductor chip features a unique design with curved fillets at the intersection of lateral surfaces.
• The curved fillets help reduce stress in the integrated circuit package.
• This innovation aims to improve the reliability and performance of semiconductor chips.
• The design may lead to enhanced durability and longevity of electronic devices.
• Implementing this technology could potentially reduce the risk of package failure in integrated circuits.

Potential Applications: This technology could be applied in various electronic devices such as smartphones, computers, and IoT devices. It may find use in industries that rely on high-performance integrated circuits, such as aerospace and automotive.

Problems Solved: Addresses the issue of stress in integrated circuit packages. Improves the overall reliability and performance of semiconductor chips.

Benefits: Enhanced durability and longevity of electronic devices. Reduced risk of package failure in integrated circuits.

Commercial Applications: Title: "Innovative Stress-Reducing Technology for Integrated Circuit Packages" This technology could be valuable for semiconductor manufacturers looking to enhance the quality and reliability of their products. It may also attract interest from companies producing consumer electronics seeking to improve the performance of their devices.

Questions about the Technology: 1. How does the curved fillet design reduce stress in integrated circuit packages? 2. What potential impact could this technology have on the semiconductor industry?

Frequently Updated Research: Stay updated on the latest advancements in stress-reducing technologies for integrated circuit packages to ensure optimal performance and reliability in electronic devices.

Original Abstract Submitted

systems, apparatus, articles of manufacture, and methods to reduce stress in integrated circuit packages are disclosed. an example semiconductor chip includes: a front surface; a back surface opposite the front surface; a first lateral surface extending between the front surface and the back surface; a second lateral surface extending between the front surface and the back surface; and a curved fillet at an intersection between the first lateral surface and the second lateral surface.