Intel corporation (20240347514). STACKED DIE NETWORK INTERFACE CONTROLLER CIRCUITRY simplified abstract
Contents
STACKED DIE NETWORK INTERFACE CONTROLLER CIRCUITRY
Organization Name
Inventor(s)
Naveed Zaman of Saratoga CA (US)
Aravind Dasu of Milpitas CA (US)
Sreedhar Ravipalli of Cupertino CA (US)
Rakesh Cheerla of Cupertino CA (US)
STACKED DIE NETWORK INTERFACE CONTROLLER CIRCUITRY - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240347514 titled 'STACKED DIE NETWORK INTERFACE CONTROLLER CIRCUITRY
The abstract describes a smart network interface controller (NIC) implemented using a stacked die configuration. The NIC includes user-customizable networking circuits in a top programmable die and primitive network function blocks in a bottom application-specific integrated circuit (ASIC) die. The top die provides a flexible packet processing pipeline for efficient control and data communication between the user-customizable circuits and the primitive network function blocks. The bottom ASIC die includes memory blocks for lookup tables and intermediate buffers for other network processing circuitry in the NIC. This configuration offers performance, power, and area benefits, as well as superior customer configurability.
- Stacked die configuration for a smart NIC
- User-customizable networking circuits in a top programmable die
- Primitive network function blocks in a bottom ASIC die
- Flexible packet processing pipeline for efficient control and data communication
- Memory blocks for lookup tables and intermediate buffers in the ASIC die
Potential Applications: - Data centers - Cloud computing - High-performance computing - Networking equipment
Problems Solved: - Efficient control and data communication in a NIC - Customizability for different networking needs - Performance optimization in network processing
Benefits: - Improved performance - Reduced power consumption - Enhanced configurability - Space-saving design
Commercial Applications: Title: "Innovative Stacked Die Smart NIC for Enhanced Networking Performance" This technology can be used in data centers, cloud computing facilities, and networking equipment to improve data processing efficiency and performance.
Prior Art: Prior art related to this technology may include research on stacked die configurations in semiconductor devices, programmable networking circuits, and ASIC designs for network processing.
Frequently Updated Research: Researchers are continually exploring new ways to optimize stacked die configurations for various applications, including networking and data processing.
Questions about Stacked Die Smart NIC: 1. How does the stacked die configuration improve the performance of the smart NIC? 2. What are the key advantages of using user-customizable networking circuits in the top programmable die?
Original Abstract Submitted
a smart network interface controller (nic) implemented using a stacked die configuration is provided. the nic may include user-customizable networking circuits formed in a top programmable die and primitive network function blocks formed in a bottom application-specific integrated circuit (asic) die. the top programmable die may provide a flexible packet processing pipeline to facilitate efficient control and data communication between the user-customizable networking circuits and the primitive network function blocks. the bottom asic die may also include an array of memory blocks operable as lookup tables and intermediate buffers for other network processing circuitry in the nic. a nic configured in this way provides both performance, power, and area benefits and superior customer configurability.
