Intel corporation (20240347402). METHODS AND APPARATUS TO REDUCE DELAMINATION IN HYBRID CORES simplified abstract
Contents
METHODS AND APPARATUS TO REDUCE DELAMINATION IN HYBRID CORES
Organization Name
Inventor(s)
Jeremy Ecton of Gilbert AZ (US)
Brandon Christian Marin of Gilbert AZ (US)
Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)
Leonel Arana of Phoenix AZ (US)
Benjamin Duong of Phoenix AZ (US)
METHODS AND APPARATUS TO REDUCE DELAMINATION IN HYBRID CORES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240347402 titled 'METHODS AND APPARATUS TO REDUCE DELAMINATION IN HYBRID CORES
Simplified Explanation: The patent application discusses methods and apparatus to reduce delamination in hybrid cores, specifically in an integrated circuit (IC) package. The example hybrid core includes a frame and a glass panel with a tapered surface.
- The patent application focuses on reducing delamination in hybrid cores.
- The hybrid core consists of a frame and a glass panel with specific design features.
- The glass panel includes a tapered surface that extends between the edge and the top surface.
- The innovation aims to improve the structural integrity of integrated circuit packages.
- By reducing delamination, the technology enhances the reliability and performance of IC packages.
Potential Applications: The technology can be applied in the manufacturing of integrated circuit packages, electronic devices, and other products that require high structural integrity.
Problems Solved: The technology addresses the issue of delamination in hybrid cores, which can lead to structural weaknesses and performance issues in integrated circuit packages.
Benefits: The technology improves the reliability, durability, and performance of integrated circuit packages by reducing delamination and enhancing structural integrity.
Commercial Applications: The technology can be utilized in the semiconductor industry to produce more reliable and high-performance integrated circuit packages, leading to improved electronic devices and systems.
Prior Art: Readers can explore prior research on hybrid core design, delamination prevention methods, and integrated circuit packaging technologies to understand the background of this innovation.
Frequently Updated Research: Stay informed about the latest advancements in hybrid core design, materials science, and integrated circuit packaging technologies to enhance your understanding of this field.
Questions about Hybrid Core Delamination: 1. How does delamination impact the performance of integrated circuit packages? 2. What are the key factors influencing delamination in hybrid cores?
Original Abstract Submitted
methods and apparatus to reduce delamination in hybrid cores are disclosed. an example hybrid core of an integrated circuit (ic) package comprises a frame, and a glass panel including a top surface, an edge adjacent the frame, and a tapered surface extending between the edge and the top surface.
