Boe technology group co., ltd. (20240339444). LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SUBSTRATE, AND DISPLAY DEVICE simplified abstract
Contents
LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SUBSTRATE, AND DISPLAY DEVICE
Organization Name
boe technology group co., ltd.
Inventor(s)
LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SUBSTRATE, AND DISPLAY DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240339444 titled 'LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SUBSTRATE, AND DISPLAY DEVICE
The abstract describes a light-emitting substrate with first and second substrates facing each other, connected by a bonding wire structure with soldered joints. The bonding wire has angled or curved portions at the solder joints.
- The innovation involves a light-emitting substrate with a unique bonding wire structure for improved connectivity.
- The first substrate includes a base substrate and a conductive pad, while the second substrate has a similar configuration.
- The bonding wire is soldered to the conductive pads on each substrate, forming secure connections.
- The bonding wire features angled or curved portions at the solder joints, enhancing flexibility and durability.
- This technology offers a reliable and efficient solution for light-emitting substrates in various applications.
Potential Applications: - LED displays - Automotive lighting systems - Electronic signage - Consumer electronics - Medical devices
Problems Solved: - Enhanced connectivity between substrates - Improved durability of bonding wire connections - Increased flexibility in design and manufacturing processes
Benefits: - Secure and reliable soldered joints - Enhanced durability and flexibility - Improved performance of light-emitting substrates - Cost-effective manufacturing process
Commercial Applications: Title: Innovative Light-Emitting Substrate Technology for Enhanced Connectivity This technology can be utilized in various industries such as LED displays, automotive lighting, and consumer electronics, offering improved performance and durability.
Questions about Light-Emitting Substrate Technology: 1. How does the unique bonding wire structure improve connectivity in light-emitting substrates? 2. What are the potential cost savings associated with using this technology in manufacturing processes?
Frequently Updated Research: Stay updated on the latest advancements in light-emitting substrate technology to ensure optimal performance and efficiency in various applications.
Original Abstract Submitted
a light-emitting substrate is provided, including first and second substrates opposite to each other, and a bonding wire structure including a bonding wire. the first substrate includes: a first base substrate and a first conductive pad. the second substrate includes a second base substrate and a second conductive pad. the first conductive pad is on a surface of the first substrate away from the second substrate, the second conductive pad is on a surface of the second substrate away from the first substrate. the bonding wire is soldered to the first conductive pad at a first solder joint and to the second conductive pad at a second solder joint. the bonding wire includes, at each of the first solder joint and the second solder joint, a portion having an angle with a plane where the first base substrate is located and/or having a curved arc.
