Apple inc. (20240345635). DESKTOP ELECTRONIC DEVICE simplified abstract

DESKTOP ELECTRONIC DEVICE

Organization Name

apple inc.

Inventor(s)

Brett W. Degner of Menlo Park CA (US)

Caitlin Elizabeth Kalinowski of San Francisco CA (US)

Richard D. Kosoglow of Sunnyvale CA (US)

Joshua D. Banko of Palo Alto CA (US)

David H. Narajowski of San Jose CA (US)

Jonathan L. Berk of Mountain View CA (US)

Michael E. Leclerc of Sunnyvale CA (US)

Michael D. Mcbroom of Leonard TX (US)

Asif Iqbal of Los Altos Hills CA (US)

Paul S. Michelsen of San Jose CA (US)

Mark K. Sin of Santa Clara CA (US)

Paul A. Baker of Los Altos CA (US)

Harold L. Sontag of Gilroy CA (US)

Wai Ching Yuen of Palo Alto CA (US)

Matthew P. Casebolt of Fremont CA (US)

Kevin S. Fetterman of Campbell CA (US)

Alexander C. Calkins of San Francisco CA (US)

Daniel L. Mcbroom of Leonard CA (US)

DESKTOP ELECTRONIC DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240345635 titled 'DESKTOP ELECTRONIC DEVICE

The abstract describes an internal component and external interface arrangement for a cylindrical compact computing system. It includes a structural heat sink with a triangular shape within a cylindrical housing, along with a computing engine with internal components such as a GPU board, CPU board, I/O interface board, interconnect board, and PSU.

• The patent describes a structural heat sink with a triangular shape for a compact computing system.
• The computing engine has internal components including a GPU board, CPU board, I/O interface board, interconnect board, and PSU.
• The arrangement is designed to fit within a cylindrical housing, optimizing space and heat dissipation.

Potential Applications: - Compact computing systems in small spaces - High-performance computing in constrained environments - Industrial applications requiring efficient heat management

Problems Solved: - Space constraints in compact computing systems - Heat dissipation in small form factor devices - Integration of multiple components in a limited space

Benefits: - Efficient heat dissipation - Space-saving design - High-performance computing capabilities

Commercial Applications: Title: "Innovative Compact Computing System for Space-Constrained Environments" This technology can be used in: - Aerospace industry for onboard computing - Medical devices for data processing - IoT devices for edge computing

Questions about the technology: 1. How does the triangular shape of the heat sink improve heat dissipation?

  The triangular shape increases surface area for better heat transfer.

2. What are the advantages of having separate boards for GPU, CPU, and I/O in the computing engine?

  Separate boards allow for easier maintenance and upgrades.

Original Abstract Submitted

an internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. a computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (gpu) board, a central processing unit (cpu) board, an input/output (v/o) interface board, an interconnect board, and a power supply unit (psu).