Taiwan semiconductor manufacturing company, ltd. (20240339475). SIGNAL SHIELDING FOR INTEGRATED CIRCUITS simplified abstract
Contents
SIGNAL SHIELDING FOR INTEGRATED CIRCUITS
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Hao-Lin Yang of Kaohsiung City (TW)
Kuan-Chieh Huang of Hsinchu City (TW)
Wei-Cheng Hsu of Kaohsiung City (TW)
Tzu-Jui Wang of Fengshan City (TW)
Chen-Jong Wang of Hsin-Chu (TW)
Dun-Nian Yaung of Taipei City (TW)
SIGNAL SHIELDING FOR INTEGRATED CIRCUITS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240339475 titled 'SIGNAL SHIELDING FOR INTEGRATED CIRCUITS
The abstract of the patent application describes an IC device with a first chip and a second chip bonded together, each comprising a dielectric layer directly contacting each other. The first chip has conductive pads arranged in a zig-zag layout and a shield line between them, while the second chip has a contact directly contacting one of the conductive pads.
- The IC device includes a first chip and a second chip bonded together at a bonding interface.
- The first and second chips have dielectric layers that directly contact each other.
- The first chip has conductive pads arranged in a zig-zag layout in rows and columns.
- A shield line is present in the first chip between the conductive pads.
- The second chip has a contact that directly contacts one of the conductive pads at the bonding interface.
Potential Applications: - Semiconductor manufacturing - Integrated circuit design - Electronics industry
Problems Solved: - Improved signal transmission between chips - Enhanced electrical connectivity - Increased reliability in IC devices
Benefits: - Better performance in IC devices - Higher efficiency in signal transmission - Enhanced durability and longevity
Commercial Applications: Title: Advanced IC Device for Enhanced Signal Transmission This technology can be used in various commercial applications such as telecommunications, consumer electronics, and automotive electronics. The improved signal transmission and connectivity offered by this IC device can lead to more reliable and efficient electronic devices in the market.
Questions about IC Device for Enhanced Signal Transmission: 1. How does the zig-zag layout of conductive pads benefit the IC device's performance? The zig-zag layout allows for a more compact arrangement of the conductive pads, improving signal transmission efficiency and reducing signal interference.
2. What role does the shield line play in the first chip of the IC device? The shield line helps to prevent electromagnetic interference between the conductive pads, ensuring a stable and reliable signal transmission.
Original Abstract Submitted
some embodiments relate to an ic device, including a first chip; and a second chip bonded to the first chip at a bonding interface; where the first and second chips respectively comprise a first dielectric layer and a second dielectric layer directly contacting; the first chip further comprises a plurality of conductive pads recessed into the first dielectric layer and in a plurality of rows and columns; where the plurality of conductive pads are arranged with a zig-zag layout along the plurality of columns and along the plurality of rows and comprise a first conductive pad and a second conductive pad; the first chip further comprises a first shield line in the first dielectric layer and laterally between the first and second conductive pads, and the second chip further comprises a contact recessed into the second dielectric layer and directly contacting the first conductive pad at the bonding interface.
