Taiwan semiconductor manufacturing company, ltd. (20240339467). ZIG-ZAG SIGNAL SHIELDING FOR PIXEL ARRAY simplified abstract

ZIG-ZAG SIGNAL SHIELDING FOR PIXEL ARRAY

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Chi-Hsien Chung of New Taipei City (TW)

Tzu-Jui Wang of Fengshan City (TW)

Chia-Chi Hsiao of Tianzhong Township (TW)

Kuan-Chieh Huang of Hsinchu City (TW)

Wei-Cheng Hsu of Kaohsiung City (TW)

Hao-Lin Yang of Kaohsiung city (TW)

Yi-Han Liao of Taichung City (TW)

Chen-Jong Wang of Hsin-Chu (TW)

Dun-Nian Yaung of Taipei City (TW)

ZIG-ZAG SIGNAL SHIELDING FOR PIXEL ARRAY - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240339467 titled 'ZIG-ZAG SIGNAL SHIELDING FOR PIXEL ARRAY

The abstract describes an IC device with a first chip containing pixel blocks with conductive pads, a second chip bonded to the first chip with recessed conductive pads, and a corrugated shield line within a dielectric layer separating the conductive pads.

• The IC device includes a first chip with pixel blocks containing conductive pads, and a second chip bonded to the first chip with recessed conductive pads.
• A corrugated shield line within a dielectric layer separates the conductive pads, providing protection and isolation.
• The conductive pads are arranged in rows and columns, allowing for efficient electrical connections within the device.
• The design of the IC device enhances signal integrity and reduces interference between neighboring conductive pads.
• This innovation improves the performance and reliability of the IC device in various electronic applications.

Potential Applications: - Consumer electronics - Telecommunications - Automotive industry - Medical devices - Industrial automation

Problems Solved: - Signal interference between conductive pads - Electrical noise in IC devices - Signal integrity issues - Reliability of electronic connections

Benefits: - Improved signal integrity - Reduced interference - Enhanced reliability - Better performance in electronic devices

Commercial Applications: Title: Advanced IC Device with Enhanced Signal Integrity This technology can be used in various commercial applications such as smartphones, tablets, IoT devices, and automotive electronics. The improved signal integrity and reduced interference make it ideal for high-performance electronic systems.

Questions about IC Device with Corrugated Shield Line: 1. How does the corrugated shield line improve signal integrity in the IC device? The corrugated shield line within the dielectric layer helps to isolate and protect the conductive pads, reducing interference and improving signal integrity.

2. What are the potential challenges in implementing this innovative design in mass production? Implementing the corrugated shield line design in mass production may require specialized manufacturing processes and materials, which could impact production costs and scalability.

Original Abstract Submitted

some embodiments relate to an ic device, including a first chip comprising a plurality of pixel blocks respectively including one of a first plurality of conductive pads, the plurality of pixel blocks arranged in rows extending in a first direction and columns extending in a second direction perpendicular to the first direction; a second chip bonded to the first chip at a bonding interface, where the second chip comprises a second plurality of conductive pad recessed and contacting the first plurality of conductive pads along the bonding interface; and a first corrugated shield line having outermost edges set-back along the second direction from outermost edges of a first row of the plurality of pixel blocks, the first corrugated shield line being arranged within a first dielectric layer and laterally separating neighboring ones of the first plurality of conductive pads within the first row of the plurality of pixel blocks.