Taiwan semiconductor manufacturing company, ltd. (20240339448). NOVEL THIN FILM RESISTOR simplified abstract

NOVEL THIN FILM RESISTOR

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Hung-Chih Yu of Hsinchu City (TW)

Chien-Mao Chen of Zhubei City (TW)

NOVEL THIN FILM RESISTOR - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240339448 titled 'NOVEL THIN FILM RESISTOR

The abstract of the patent application describes a semiconductor device with a metal thin film on a semiconductor substrate, along with first and second contact structures spaced apart by a dummy layer containing a polishing resistance material.

• Simplified Explanation:

The patent application discusses a semiconductor device that has a metal thin film on a semiconductor substrate, with contact structures separated by a dummy layer containing a polishing resistance material.

• Key Features and Innovation:

- Metal thin film on semiconductor substrate - Contact structures separated by dummy layer - Dummy layer contains polishing resistance material

• Potential Applications:

- Semiconductor manufacturing - Electronics industry - Integrated circuits

• Problems Solved:

- Improved polishing resistance - Enhanced device performance - Better contact structure design

• Benefits:

- Increased device reliability - Enhanced manufacturing process - Improved overall performance

• Commercial Applications:

- Semiconductor fabrication companies - Electronics manufacturers - Research institutions

• Prior Art:

- Prior research on semiconductor device structures - Previous patents related to contact structures in semiconductor devices

• Frequently Updated Research:

- Ongoing developments in semiconductor device technology - Latest advancements in contact structure design

Questions about semiconductor devices: 1. How does the dummy layer with a polishing resistance material improve the performance of the semiconductor device? 2. What are the potential commercial applications of this technology in the electronics industry?

Original Abstract Submitted

a semiconductor device includes: a metal thin film disposed on a semiconductor substrate; and first and second contact structures disposed on the metal thin film, wherein the first and second contact structures are laterally spaced from each other by a dummy layer that comprises at least one polishing resistance material.