Taiwan semiconductor manufacturing company, ltd. (20240339427). MANUFACTURING METHOD OF PACKAGE STRUCTURE AND PACKAGE STRUCTURE THEREOF simplified abstract

MANUFACTURING METHOD OF PACKAGE STRUCTURE AND PACKAGE STRUCTURE THEREOF

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Po-Yuan Teng of Hsinchu city (TW)

Hao-Yi Tsai of Hsinchu City (TW)

Kuo-Lung Pan of Hsinchu city (TW)

Sen-Kuei Hsu of Kaohsiung City (TW)

Tin-Hao Kuo of Hsinchu City (TW)

Yi-Yang Lei of Taichung City (TW)

Ying-Cheng Tseng of Tainan City (TW)

Chi-Hui Lai of Taichung City (TW)

MANUFACTURING METHOD OF PACKAGE STRUCTURE AND PACKAGE STRUCTURE THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240339427 titled 'MANUFACTURING METHOD OF PACKAGE STRUCTURE AND PACKAGE STRUCTURE THEREOF

The patent application describes a package structure that includes a semiconductor die and a redistribution structure. The semiconductor die is encapsulated by an encapsulant, and the redistribution structure is electrically connected to the semiconductor die.

• The redistribution structure consists of signal lines and repair lines.
• The signal lines include first signal lines at a first level, each with a break splitting it into separate fragments.
• The repair lines are positioned above the first signal lines and cover the breaks, connecting the fragments.

Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor packages. - It can improve the reliability and performance of electronic devices.

Problems Solved: - Enhances the electrical connectivity and signal integrity within semiconductor packages. - Provides a solution for repairing signal lines with breaks.

Benefits: - Increased reliability and performance of electronic devices. - Improved signal integrity and connectivity within semiconductor packages.

Commercial Applications: Title: Advanced Semiconductor Package Structure for Improved Signal Integrity This technology can be applied in the production of high-performance electronic devices, such as smartphones, tablets, and computers. It can also benefit industries that require reliable and efficient semiconductor packaging solutions.

Questions about the technology: 1. How does this package structure improve signal integrity in semiconductor devices? 2. What are the potential challenges in implementing this technology in mass production?

Frequently Updated Research: Stay updated on the latest advancements in semiconductor packaging technologies to leverage the benefits of this innovative structure. Regularly check industry publications and research journals for new developments in this field.

Original Abstract Submitted

a package structure including at least one semiconductor die and a redistribution structure is provided. the semiconductor die is laterally encapsulated by an encapsulant, and the redistribution structure is disposed on the semiconductor die and the encapsulant and electrically connected with the semiconductor die. the redistribution structure includes signal lines and a pair of repair lines. the signal lines include a pair of first signal lines located at a first level, and each first signal line of the pair of first signal lines has a break that split each first signal line into separate first and second fragments. the pair of repair lines is located above the pair of first signal lines and located right above the break. opposite ending portions of each repair line are respectively connected with the first and second fragments with each repair line covering the break in each first signal line.