Taiwan semiconductor manufacturing company, ltd. (20240339424). MICROBUMP STRUCTURE WITH ENCLOSED JOINT WINDOW simplified abstract
Contents
MICROBUMP STRUCTURE WITH ENCLOSED JOINT WINDOW
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Hsin Liang Chen of New Taipei (TW)
Ching-Hua Hsieh of Hsinchu (TW)
MICROBUMP STRUCTURE WITH ENCLOSED JOINT WINDOW - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240339424 titled 'MICROBUMP STRUCTURE WITH ENCLOSED JOINT WINDOW
The patent application describes a device structure and method that includes an infill structure to capture solder materials within openings of the infill structure, allowing metal pillars of one device to penetrate through a non-conductive film and contact solder regions of another device without the need for a separate underfill.
- Metal pillars can penetrate through a non-conductive film to contact solder regions of another device.
- An infill structure captures solder materials within its openings.
- Eliminates the need for a separate underfill in the device structure.
- Enhances the efficiency and reliability of the soldering process.
- Simplifies the manufacturing process of electronic devices.
Potential Applications: - Electronics manufacturing - Semiconductor industry - Printed circuit board assembly
Problems Solved: - Simplifies the soldering process in electronic device manufacturing. - Improves the reliability of solder connections. - Reduces the need for additional materials and steps in the manufacturing process.
Benefits: - Enhanced efficiency in electronic device manufacturing. - Improved reliability of solder connections. - Cost savings due to the elimination of a separate underfill material.
Commercial Applications: Title: Advanced Soldering Technology for Electronic Devices This technology can be utilized in the production of various electronic devices, such as smartphones, laptops, and tablets, to improve the soldering process and enhance the overall reliability of the devices.
Questions about the technology: 1. How does this technology improve the reliability of solder connections in electronic devices? - This technology ensures better contact between metal pillars and solder regions, reducing the risk of connection failures. 2. What are the potential cost savings associated with eliminating the need for a separate underfill material in device manufacturing? - By removing the need for an underfill material, manufacturers can reduce material costs and streamline the manufacturing process.
Original Abstract Submitted
embodiments provide a device structure and method of forming a device structure including an infill structure to capture solder materials within confines of openings of the infill structure. metal pillars of one device can penetrate through a non-conductive film and contact solder regions of another device. a separate underfill is not needed.
