Taiwan semiconductor manufacturing company, ltd. (20240339415). PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME simplified abstract

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Tsung-Fu Tsai of Changhua County (TW)

Szu-Wei Lu of Hsinchu City (TW)

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240339415 titled 'PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Simplified Explanation: The patent application describes a structure consisting of a semiconductor die, an interposer, and an insulating encapsulation. The semiconductor die has a substrate, an interconnect structure, and conductive vias. The interposer includes a dielectric layer with through vias, while the insulating encapsulation surrounds both the semiconductor die and the interposer.

• The structure includes a semiconductor die, interposer, and insulating encapsulation.
• The semiconductor die has a substrate, interconnect structure, and conductive vias.
• The interposer features a dielectric layer with through vias.
• The insulating encapsulation surrounds the semiconductor die and interposer.
• The thickness of the dielectric layer matches that of the semiconductor die and insulating encapsulation.

Potential Applications: 1. Advanced electronic devices 2. Semiconductor manufacturing 3. High-performance computing systems

Problems Solved: 1. Enhanced thermal management 2. Improved electrical performance 3. Increased reliability of semiconductor components

Benefits: 1. Better heat dissipation 2. Enhanced signal transmission 3. Longer lifespan of semiconductor devices

Commercial Applications: The technology could be utilized in the development of next-generation electronic devices, improving their performance and reliability in various industries such as telecommunications, automotive, and aerospace.

Questions about the Technology: 1. How does the structure of the semiconductor die and interposer contribute to overall device performance? 2. What are the potential cost implications of implementing this technology in semiconductor manufacturing processes?

Frequently Updated Research: Ongoing research in semiconductor packaging and thermal management techniques could provide further insights into optimizing the design and performance of similar structures.

Original Abstract Submitted

a structure including a first semiconductor die, an interposer and a first insulating encapsulation is provided. the first semiconductor die includes a semiconductor substrate, an interconnect structure disposed on the semiconductor substrate and conductive vias disposed on the interconnect structure. the interposer includes a dielectric layer and through vias penetrating through the dielectric layer. the first insulating encapsulation laterally encapsulates the first semiconductor die and the interposer, wherein a thickness of the dielectric layer of the interposer substantially equals to a thickness of the first semiconductor die and a thickness of the first insulating encapsulation.