Taiwan semiconductor manufacturing company, ltd. (20240339408). Semiconductor Package and Method simplified abstract
Contents
Semiconductor Package and Method
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Jiun Yi Wu of Zhongli City (TW)
Semiconductor Package and Method - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240339408 titled 'Semiconductor Package and Method
The semiconductor structure described in the abstract includes a complex arrangement of redistribution structures, local interconnect components, and interconnect structures.
- The first local interconnect component consists of multiple redistribution layers with conductive features that connect to the first redistribution structure.
- The first interconnect structure, located above the first local interconnect component, contains additional conductive features that are connected through the local interconnect component.
- The interconnection between the second plurality of conductive features and the third plurality of conductive features is facilitated by the first local interconnect component.
Potential Applications: - This semiconductor structure could be used in advanced electronic devices such as smartphones, tablets, and computers. - It may find applications in high-speed data processing systems and communication devices.
Problems Solved: - Provides a more efficient and compact way to interconnect various components within a semiconductor structure. - Enhances the overall performance and reliability of electronic devices.
Benefits: - Improved signal transmission and reduced signal interference. - Higher integration density leading to smaller and more powerful electronic devices.
Commercial Applications: - This technology could be valuable for semiconductor manufacturers looking to enhance the performance of their products. - It may also be of interest to companies developing cutting-edge electronic devices for consumer and industrial markets.
Questions about the technology: 1. How does the first local interconnect component improve the overall efficiency of the semiconductor structure? 2. What are the specific advantages of using multiple redistribution layers in the first local interconnect component?
Frequently Updated Research: - Stay updated on the latest advancements in semiconductor interconnect technologies to ensure optimal performance and compatibility with evolving electronic devices.
Original Abstract Submitted
a semiconductor structure includes a first redistribution structure, a first local interconnect component disposed on the first redistribution structure, and a first interconnect structure over a second side of the first local interconnect component. the first local interconnect component includes a first plurality of redistribution layers. the first plurality of redistribution layers includes a first plurality of conductive features on a first side of the first local interconnect component. each of the first plurality of conductive features are coupled to respective conductive features of the first redistribution structure. the first interconnect structure includes a second plurality of conductive features and a third plurality of conductive features. the second plurality of conductive features are electrically coupled to the third plurality of conductive features through the first local interconnect component.
