Taiwan semiconductor manufacturing company, ltd. (20240339396). SELF-ALIGNED VIA STRUCTURES AND METHODS simplified abstract
Contents
SELF-ALIGNED VIA STRUCTURES AND METHODS
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Chieh-Han Wu of Kaohsiung City (TW)
Cheng-Hsiung Tsai of Miaoli County (TW)
Chih Wei Lu of Hsinchu City (TW)
Chung-Ju Lee of Hsinchu City (TW)
SELF-ALIGNED VIA STRUCTURES AND METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240339396 titled 'SELF-ALIGNED VIA STRUCTURES AND METHODS
The abstract of this patent application describes interconnect structures involving conductive line features, etch stop layers, contact vias, and barrier layers.
- Conductive line feature over a substrate
- Conductive etch stop layer over the conductive line feature
- Contact via over the conductive etch stop layer
- Barrier layer along the sidewalls of the conductive line feature, etch stop layer, and contact via
Potential Applications: - Semiconductor manufacturing - Integrated circuit fabrication - Electronics industry
Problems Solved: - Improving interconnect reliability - Enhancing signal transmission efficiency - Reducing signal interference
Benefits: - Increased performance of electronic devices - Enhanced durability of interconnect structures - Improved overall functionality of integrated circuits
Commercial Applications: Title: Advanced Interconnect Structures for High-Performance Electronics This technology could be utilized in the production of high-speed processors, memory chips, and other electronic components where efficient signal transmission is crucial. The market implications include faster and more reliable electronic devices, leading to improved user experience and increased demand for cutting-edge technology.
Questions about Interconnect Structures: 1. How do these interconnect structures contribute to the overall performance of electronic devices? 2. What sets these interconnect structures apart from traditional methods in terms of efficiency and reliability?
Frequently Updated Research: Researchers are constantly exploring new materials and techniques to further enhance the performance and reliability of interconnect structures in electronic devices. Stay updated on the latest advancements in semiconductor technology to leverage the full potential of this innovation.
Original Abstract Submitted
interconnect structures and methods of forming the same are provided. an interconnect structure according to the present disclosure includes a conductive line feature over a substrate, a conductive etch stop layer over the conductive line feature, a contact via over the conductive etch stop layer, and a barrier layer disposed along a sidewall of the conductive line feature, a sidewall of the conductive etch stop layer, and a sidewall of the contact via.
