Taiwan semiconductor manufacturing company, ltd. (20240339369). STRUCTURE AND FORMATION METHOD OF PACKAGE STRUCTURE WITH CAPACITOR simplified abstract
Contents
STRUCTURE AND FORMATION METHOD OF PACKAGE STRUCTURE WITH CAPACITOR
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Wen-Shiang Liao of Miaoli County (TW)
STRUCTURE AND FORMATION METHOD OF PACKAGE STRUCTURE WITH CAPACITOR - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240339369 titled 'STRUCTURE AND FORMATION METHOD OF PACKAGE STRUCTURE WITH CAPACITOR
- Simplified Explanation:**
The patent application describes a method for forming a package structure for a semiconductor chip by surrounding the chip with a protective layer, creating an opening, filling the opening with a dielectric structure, and forming a redistribution structure over the chip.
- Key Features and Innovation:**
- Surrounding a semiconductor chip with a protective layer.
- Partially removing the protective layer to create an opening.
- Filling the opening with a dielectric structure of higher dielectric constant.
- Forming a redistribution structure over the semiconductor chip.
- Potential Applications:**
This technology can be applied in the semiconductor industry for packaging and protecting semiconductor chips.
- Problems Solved:**
This technology addresses the need for efficient and reliable packaging of semiconductor chips to protect them from external elements.
- Benefits:**
- Enhanced protection for semiconductor chips.
- Improved performance and reliability of packaged chips.
- Commercial Applications:**
The technology can be utilized by semiconductor companies for packaging their chips in a more efficient and reliable manner, potentially leading to improved product quality and performance in various electronic devices.
- Prior Art:**
Readers can explore prior patents related to semiconductor packaging methods and dielectric structures to gain a deeper understanding of the technological advancements in this field.
- Frequently Updated Research:**
Stay updated on the latest research in semiconductor packaging methods and dielectric materials to further enhance the efficiency and reliability of semiconductor chip packaging.
- Questions about Semiconductor Chip Packaging:**
1. What are the key considerations in choosing the dielectric material for packaging semiconductor chips? 2. How does the formation of a redistribution structure contribute to the overall performance of the packaged semiconductor chip?
Original Abstract Submitted
a package structure and a formation method of a package structure are provided. the method includes surrounding a semiconductor chip with a protective layer. the protective layer has a first dielectric constant. the method also includes partially removing the protective layer to form an opening. the method further includes forming a dielectric structure partially or completely filling the opening. the dielectric structure has a second dielectric constant, and the second dielectric constant is higher than the first dielectric constant. the method further includes forming a redistribution structure over the semiconductor chip, the protective layer, and the dielectric structure.
