Taiwan semiconductor manufacturing company, ltd. (20240339326). WAFER EDGE TRIMMING PROCESS AND METHODS THEREOF simplified abstract
Contents
WAFER EDGE TRIMMING PROCESS AND METHODS THEREOF
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Fang-I Chen of New Taipei City (TW)
Pei-Keng Tsai of New Taipei City (TW)
Hui-Chi Huang of Zhubei City (TW)
WAFER EDGE TRIMMING PROCESS AND METHODS THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240339326 titled 'WAFER EDGE TRIMMING PROCESS AND METHODS THEREOF
The method described in the abstract involves trimming a wafer by directing a water jet at the edge to create cracks, inserting a wedge to expand the cracks, and removing material from the edge during rotation.
- Securing the wafer on a wafer chuck
- Directing a water jet at the wafer edge to create cracks
- Inserting a wedge into the cracks to remove material
- Rotating the wafer to facilitate the trimming process
Potential Applications: - Semiconductor manufacturing - Microelectronics industry - Wafer fabrication processes
Problems Solved: - Efficient wafer trimming - Precision edge removal - Minimizing material waste
Benefits: - Improved wafer quality - Enhanced productivity - Cost-effective trimming process
Commercial Applications: Title: Advanced Wafer Edge Trimming Technology for Semiconductor Industry This technology can be used in semiconductor fabrication facilities to streamline the wafer trimming process, leading to higher yields and reduced production costs.
Prior Art: Researchers can explore prior patents related to wafer trimming methods, water jet cutting technologies, and semiconductor manufacturing processes to gain insights into the development of this innovation.
Frequently Updated Research: Researchers in the field of semiconductor manufacturing may conduct studies on the optimization of wafer trimming techniques, the impact of edge quality on device performance, and the integration of advanced materials in wafer fabrication processes.
Questions about Wafer Edge Trimming Technology: 1. How does this method compare to traditional wafer trimming techniques? This method offers a more precise and efficient way to trim wafers compared to traditional mechanical methods, resulting in higher quality edges and reduced material waste.
2. What are the key factors to consider when implementing this technology in a semiconductor manufacturing facility? Factors to consider include the compatibility of the equipment with existing processes, the training required for operators, and the potential cost savings and productivity improvements.
Original Abstract Submitted
a method of trimming a wafer includes securing the wafer on a top surface of a wafer chuck of a wafer edge trimming apparatus, directing a water jet at an edge of the wafer to form a plurality of cracks at uniform intervals along the edge of the wafer, inserting a wedge of a removal module into a first crack of the plurality of cracks, and rotating the wafer, where during the rotation of the wafer, the wedge expands the first crack of the plurality of cracks and removes material from the edge of the wafer.
