Taiwan semiconductor manufacturing company, ltd. (20240337947). METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
Contents
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Yuan Chih Lo of Hsinchu City (TW)
Ming-Hui Weng of New Taipei City (TW)
Cheng-Han Wu of Taichung City (TW)
Ching-Yu Chang of Yilang County (TW)
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240337947 titled 'METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
The method of manufacturing a semiconductor device involves forming a metal oxide photoresist layer over a target layer, exposing it to extreme ultraviolet radiation, treating it with a ligand leaving promoter, and developing it to form a patterned photoresist which is then used as an etching mask to etch the target layer.
- Metal oxide photoresist layer is formed over a target layer.
- Metal oxide photoresist layer contains metal oxide core with organic ligands.
- Metal oxide photoresist layer is exposed to extreme ultraviolet radiation.
- Metal oxide photoresist layer is treated with a ligand leaving promoter.
- Patterned photoresist is developed to etch the target layer using it as an etching mask.
Potential Applications: - Semiconductor manufacturing - Microelectronics industry - Nanotechnology research
Problems Solved: - Improved precision in semiconductor device manufacturing - Enhanced etching process control - Increased efficiency in pattern transfer
Benefits: - Higher quality semiconductor devices - Cost-effective manufacturing process - Reduced production time
Commercial Applications: Title: Advanced Semiconductor Manufacturing Process This technology can be utilized in the production of various semiconductor devices such as microchips, sensors, and integrated circuits. The market implications include improved product performance, reduced manufacturing costs, and increased competitiveness in the semiconductor industry.
Questions about Semiconductor Manufacturing: 1. How does the use of metal oxide photoresist layers improve the semiconductor manufacturing process?
- Metal oxide photoresist layers enhance precision and control in patterning, leading to higher quality semiconductor devices.
2. What are the potential challenges in implementing extreme ultraviolet radiation exposure in semiconductor manufacturing?
- Challenges may include equipment costs, process optimization, and material compatibility.
Original Abstract Submitted
a method of manufacturing a semiconductor device includes the following operations. a metal oxide photoresist layer is formed over a target layer. the metal oxide photoresist layer comprises a metal oxide core with organic ligands, a metal oxide framework with organic ligands, or a combination thereof. the metal oxide photoresist layer is exposed to an extreme ultraviolet radiation. the metal oxide photoresist layer is treated with a ligand leaving promoter. the metal oxide photoresist layer is developed to form a patterned photoresist. the target layer is etched by using the patterned photoresist as an etching mask.
