Taiwan semiconductor manufacturing company, ltd. (20240337265). CRYOGENIC PUMP FOR SEMICONDUCTOR PROCESSING simplified abstract

From WikiPatents
Revision as of 23:57, 13 October 2024 by Wikipatents (talk | contribs) (Creating a new page)
(diff) ← Older revision | Latest revision (diff) | Newer revision → (diff)
Jump to navigation Jump to search

CRYOGENIC PUMP FOR SEMICONDUCTOR PROCESSING

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Yu Min Chi of Hsinchu (TW)

Yi-Chieh Lo of Taichung (TW)

Kuo-Lung Hou of Taichung (TW)

Wei-Jen Chen of Hsinchu (TW)

Su-Yu Yeh of Hsinchu (TW)

CRYOGENIC PUMP FOR SEMICONDUCTOR PROCESSING - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240337265 titled 'CRYOGENIC PUMP FOR SEMICONDUCTOR PROCESSING

The abstract describes a cryogenic pump for semiconductor processing, consisting of a body with a flange for attachment to a process chamber, an opening at one end, capture plate modules within the body, and a cold header thermally connected to the capture plate modules. The body has a smaller lateral dimension at the opening end compared to the other end.

  • The cryogenic pump is designed for use in semiconductor processing.
  • It includes capture plate modules for efficient operation.
  • The cold header ensures proper thermal management.
  • The body's unique design optimizes performance.
  • The pump is specifically tailored for cryogenic applications.

Potential Applications: This technology can be used in semiconductor manufacturing processes, specifically in cryogenic environments where precise temperature control is essential. It can also be applied in other industries requiring high-performance vacuum pumps.

Problems Solved: The cryogenic pump addresses the need for efficient and reliable vacuum pumping in semiconductor processing, where extreme temperatures are involved. It ensures proper cooling and thermal management to maintain optimal performance.

Benefits: - Enhanced efficiency in semiconductor processing - Improved temperature control in cryogenic environments - Reliable vacuum pumping for critical applications - Long-lasting performance and durability - Tailored design for specific industry needs

Commercial Applications: Title: Cryogenic Pump for Semiconductor Processing: Commercial Uses and Market Implications This technology has significant commercial potential in the semiconductor industry, where precise vacuum pumping and temperature control are crucial for high-quality manufacturing processes. It can also be utilized in research and development settings where cryogenic conditions are required.

Prior Art: Readers interested in exploring prior art related to cryogenic pumps for semiconductor processing can start by researching patents and publications in the field of vacuum technology, cryogenics, and semiconductor manufacturing processes.

Frequently Updated Research: Researchers in the field of cryogenic pumps and semiconductor processing are constantly exploring new materials and designs to improve efficiency and performance. Stay updated on the latest advancements in vacuum technology and cryogenics to enhance your understanding of this technology.

Questions about Cryogenic Pump for Semiconductor Processing: 1. What are the key advantages of using a cryogenic pump in semiconductor processing? 2. How does the design of this cryogenic pump contribute to its efficiency and performance?


Original Abstract Submitted

embodiments of the present disclosure provide a cryogenic pump for semiconductor processing, including a body having a flange, configured to be coupled to a process chamber, and an opening defined at a first end of the body; one or more capture plate modules disposed in the body; and a cold header thermally coupled to the one or more capture plate modules. a longitudinal axis of the body is defined from the first end of the body to a second end of the body. a first lateral dimension of the opening is less than a second lateral dimension of the body, the first and second lateral dimensions being defined perpendicular to the longitudinal axis. the second lateral dimension is defined at a position between the opening and the second end.