Taiwan semiconductor manufacturing company, ltd. (20240335957). VACUUM TIP ASSEMBLY FOR USE IN PICK-AND-PLACE TOOL simplified abstract
Contents
VACUUM TIP ASSEMBLY FOR USE IN PICK-AND-PLACE TOOL
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Ching Hsien Liu of Hsinchu (TW)
Sheng-Po Tseng of Hsinchu (TW)
Chen Liang Chang of Hsinchu (TW)
VACUUM TIP ASSEMBLY FOR USE IN PICK-AND-PLACE TOOL - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240335957 titled 'VACUUM TIP ASSEMBLY FOR USE IN PICK-AND-PLACE TOOL
Simplified Explanation: The patent application describes die pick and place tools with an improved vacuum tip for handling integrated circuit dies without deforming them.
- The vacuum tip has grooves on the top surface that extend radially outward from the center point of the body.
- A channel in the body allows for attachment and detachment of the die without deformation.
- The grooves and channel are co-axial, ensuring efficient die transportation.
Key Features and Innovation:
- Grooves on the vacuum tip prevent deformation of integrated circuit dies during transportation.
- Co-axial channel allows for easy attachment and detachment of the die.
- Radially outward grooves provide stability and precision in die handling.
Potential Applications: This technology can be used in semiconductor manufacturing processes where delicate handling of integrated circuit dies is required.
Problems Solved: The technology addresses the issue of die deformation during transportation, ensuring the integrity of integrated circuit dies.
Benefits:
- Improved precision and stability in die handling.
- Reduced risk of damage to integrated circuit dies.
- Enhanced efficiency in semiconductor manufacturing processes.
Commercial Applications: Potential commercial applications include semiconductor manufacturing companies looking to improve the quality and efficiency of their die handling processes.
Prior Art: Readers can explore prior art related to vacuum tips for die handling in semiconductor manufacturing processes to understand the evolution of this technology.
Frequently Updated Research: Stay updated on advancements in die handling technologies in semiconductor manufacturing processes to enhance efficiency and quality.
Questions about Die Pick and Place Tools with Improved Vacuum Tip: 1. How does the vacuum tip prevent deformation of integrated circuit dies? 2. What are the potential commercial applications of this technology?
Original Abstract Submitted
embodiments of the present disclosure provide die pick and place tools with an improved vacuum tip that can perform attachment and detachment of an integrated circuit die without deforming dies. in one embodiment, a vacuum tip for transporting an integrated circuit die is provided. the vacuum tip includes a body having a top surface and a bottom surface, a plurality of grooves formed in the top surface and into the body, wherein the grooves extend radially outward from a center point of the body. the vacuum tip also includes a channel in the body, wherein the channel extends from a bottom of the grooves through the body to the bottom surface of the body, and the channel and the body are substantially co-axial.
