Qualcomm incorporated (20240339414). HYBRID CORE SUBSTRATE WITH EMBEDDED COMPONENTS simplified abstract
Contents
HYBRID CORE SUBSTRATE WITH EMBEDDED COMPONENTS
Organization Name
Inventor(s)
Jaehyun Yeon of San Diego CA (US)
Suhyung Hwang of Rancho Mission Viejo CA (US)
Omar James Bchir of San Marcos CA (US)
HYBRID CORE SUBSTRATE WITH EMBEDDED COMPONENTS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240339414 titled 'HYBRID CORE SUBSTRATE WITH EMBEDDED COMPONENTS
Simplified Explanation: The patent application describes a hybrid core substrate with embedded components and methods for its production. The substrate includes a rigid core, laminate layers with embedded components, and electrical connections.
- The hybrid core substrate consists of a rigid core with laminate layers mounted on top.
- The first laminate layer structure has a cavity for embedding a component.
- The second laminate layer structure is mounted on top of the first layer and has electrical connections to the embedded component.
- Contacts on the top surface of the second laminate layer provide electrical connections.
- The substrate allows for embedding components and establishing electrical connections within the structure.
Key Features and Innovation:
- Hybrid core substrate design with embedded components.
- Integration of electrical connections within the substrate.
- Multi-layer structure for component embedding and electrical connectivity.
Potential Applications: The technology can be used in electronic devices, circuit boards, and other applications requiring embedded components and electrical connections.
Problems Solved: The technology addresses the need for compact and integrated solutions for embedding components and establishing electrical connections within a substrate.
Benefits:
- Space-saving design.
- Enhanced structural integrity.
- Simplified manufacturing process.
Commercial Applications: The technology can be applied in the electronics industry for compact and efficient circuit board designs, potentially reducing production costs and improving overall performance.
Questions about Hybrid Core Substrate: 1. How does the embedded component interact with the rest of the substrate? 2. What are the advantages of using a hybrid core substrate compared to traditional methods of component integration?
Original Abstract Submitted
a hybrid core substrate with embedded components, and methods for making the same, are disclosed. in an aspect a hybrid core substrate comprises a rigid core, a first laminate layer structure disposed above and mounted to the top surface of the rigid core and having a cavity in which a first component is embedded, and a second laminate layer structure disposed above and mounted to a top surface of the first laminate layer structure and having at least one electrical connection to the first laminate layer structure and at least one electrical connection to the first component, a first plurality of contacts disposed on the top surface of the second laminate layer structure and electrically connected to the second laminate layer structure. in some aspects, at least one contact is electrically connected to the embedded component.
