Samsung electronics co., ltd. (20240339411). SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
Contents
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Organization Name
Inventor(s)
SEUNGYEON Rhee of Suwon-si (KR)
CHOONGBIN Yim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240339411 titled 'SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
The semiconductor package described in the patent application consists of a substrate, a first three-dimensional integrated circuit structure, and a second three-dimensional integrated circuit structure on the substrate. The first structure includes a first interposer with a first semiconductor die and a second semiconductor die, while the second structure includes a second interposer with a third semiconductor die and a fourth semiconductor die. The substrate features electrical routing to relay signals from the second and fourth semiconductor dies.
- The semiconductor package includes a substrate, first and second three-dimensional integrated circuit structures, and interposers with multiple semiconductor dies.
- The substrate is equipped with electrical routing for signal relay between different semiconductor dies.
- The innovative design allows for efficient signal transmission and processing within the semiconductor package.
- The use of multiple interposers and semiconductor dies enhances the overall functionality and performance of the package.
- This technology enables advanced semiconductor packaging solutions for high-performance applications.
Potential Applications: - High-performance computing - Data centers - Artificial intelligence and machine learning systems - Telecommunications infrastructure - Automotive electronics
Problems Solved: - Enhanced signal processing capabilities - Improved efficiency in semiconductor packaging - Increased performance in complex electronic systems
Benefits: - Higher processing speeds - Improved signal reliability - Enhanced overall system performance - Greater flexibility in design and integration
Commercial Applications: Title: Advanced Semiconductor Packaging Solutions for High-Performance Applications This technology can be utilized in various industries such as data centers, telecommunications, automotive, and AI systems, offering improved performance and efficiency in electronic systems.
Questions about Semiconductor Packaging Solutions: 1. How does the use of multiple interposers and semiconductor dies improve signal processing in the semiconductor package? 2. What are the potential advantages of utilizing a substrate with electrical routing for signal relay in semiconductor packaging?
Frequently Updated Research: Stay updated on the latest advancements in semiconductor packaging technology, including research on signal transmission efficiency, interposer design, and system integration.
Original Abstract Submitted
a semiconductor package includes a substrate, a first three-dimensional integrated circuit structure on the substrate, and a second three-dimensional integrated circuit structure on the substrate, where the first three-dimensional integrated circuit structure may include a first interposer including a first semiconductor die, and a second semiconductor die on the first interposer, where the second three-dimensional integrated circuit structure may include a second interposer including a third semiconductor die, and a fourth semiconductor die on the second interposer, where the substrate may include an electrical routing configured to relay a signal from the second semiconductor die and a signal from the fourth semiconductor die.
