Samsung electronics co., ltd. (20240339403). SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME simplified abstract

SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

Organization Name

samsung electronics co., ltd.

Inventor(s)

Moorym Choi of Suwon-si (KR)

Taeyong Kim of Suwon-si (KR)

Sunil Shim of Suwon-si (KR)

Minhee Lee of Suwon-si (KR)

Yunsun Jang of Suwon-si (KR)

Hayoung Jeong of Suwon-si (KR)

SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240339403 titled 'SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

The semiconductor device described in the abstract consists of two semiconductor structures bonded together, each with specific components and features.

• The first semiconductor structure includes a first substrate and a lower bonding structure.
• The second semiconductor structure includes a second substrate and an upper bonding structure bonded to the lower bonding structure.
• The second semiconductor structure also includes via patterns, a source contact pad, a source contact plug, a source contact via, and an interconnection line.
• The lower surfaces of the via patterns are positioned further from the first substrate than the lower surface of the source contact via.
• The upper surface of the second substrate is positioned farther from the first substrate than the upper surface of the source contact pad.

Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor devices for various electronic applications. - It can enhance the performance and efficiency of integrated circuits and other electronic components.

Problems Solved: - This technology addresses the need for improved semiconductor device structures with enhanced functionality and connectivity. - It solves the challenge of optimizing the layout and design of semiconductor components for better performance.

Benefits: - Improved electrical connectivity and signal transmission within semiconductor devices. - Enhanced overall performance and efficiency of electronic systems. - Potential for smaller and more compact device designs.

Commercial Applications: Title: Advanced Semiconductor Device Technology for Enhanced Electronic Systems This technology can be applied in the development of high-performance electronic devices such as smartphones, computers, and IoT devices. It can also be utilized in the automotive industry for advanced driver assistance systems and in the aerospace sector for avionics applications.

Questions about the technology: 1. How does the positioning of the via patterns and source contact via contribute to the overall performance of the semiconductor device? 2. What are the specific materials used in the source contact pad and how do they impact the functionality of the device?

Original Abstract Submitted

a semiconductor device includes a first semiconductor structure including a first substrate, and a lower bonding structure on the first substrate, and a second semiconductor structure including a second substrate, and an upper bonding structure bonded to the lower bonding structure. the second semiconductor structure includes via patterns on the second substrate, a source contact pad including a material different from that of the second substrate, a source contact plug electrically connected to the source contact pad, a source contact via on the source contact pad, and an interconnection line that electrically connects the via patterns to the source contact plug. lower surfaces of the via patterns are farther from the first substrate than a lower surface of the source contact via, and an upper surface of the second substrate is farther from the first substrate than an upper surface of the source contact pad.