Samsung electronics co., ltd. (20240339391). ELECTRONIC DEVICE INCLUDING INTERPOSER AND METHOD FOR MANUFACTURING SAME simplified abstract
Contents
ELECTRONIC DEVICE INCLUDING INTERPOSER AND METHOD FOR MANUFACTURING SAME
Organization Name
Inventor(s)
Sanghoon Park of Suwon-si (KR)
ELECTRONIC DEVICE INCLUDING INTERPOSER AND METHOD FOR MANUFACTURING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240339391 titled 'ELECTRONIC DEVICE INCLUDING INTERPOSER AND METHOD FOR MANUFACTURING SAME
The abstract describes an electronic device with a first printed circuit board, a second printed circuit board, and an interposer that connects the two boards.
- The interposer includes multiple vias with varying diameters and plating layers to facilitate connections between the circuit boards.
- The first via has a hole and a plating layer, while the second via has a larger hole and a plating layer that contacts the first plating layer.
- The third via also has a larger hole and a plating layer that contacts the first plating layer, enabling complex circuit connections.
Potential Applications:
- This technology can be used in various electronic devices that require intricate circuit connections.
- It can improve the efficiency and reliability of electronic systems by providing a stable interconnection platform.
Problems Solved:
- The technology addresses the need for complex circuit connections in electronic devices.
- It streamlines the manufacturing process by simplifying the assembly of circuit boards.
Benefits:
- Enhanced connectivity and signal transmission between circuit boards.
- Improved overall performance and reliability of electronic devices.
Commercial Applications:
- This technology can be applied in the manufacturing of smartphones, computers, and other consumer electronics.
- It can also be used in industrial equipment and automotive systems to improve connectivity and functionality.
Questions about the technology: 1. How does the varying diameter of the vias in the interposer contribute to the efficiency of circuit connections? 2. What are the specific advantages of using an interposer in electronic devices compared to traditional circuit board connections?
Original Abstract Submitted
an electronic device according to various embodiments of the disclosure may include: a first printed circuit board; a second printed circuit board; and an interposer having one surface on which the first printed circuit board is disposed and the other surface on which the second printed circuit board is disposed, wherein the interposer includes: a first via including a first via hole and a first plating layer; a second via including a second via hole having a diameter being increased toward a direction getting away from the first via and a second plating layer coming in contact with the first plating layer, and disposed at one end of the first via; a third via hole having a diameter being increased toward the direction getting away from the first via and a third plating layer coming in contact with the first plating layer.
