Samsung electronics co., ltd. (20240339336). SUBSTRATE HAVING UNDERFILL DAM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
SUBSTRATE HAVING UNDERFILL DAM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE
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SUBSTRATE HAVING UNDERFILL DAM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240339336 titled 'SUBSTRATE HAVING UNDERFILL DAM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a substrate with a bottom die connected to first bonding pads, a top die connected to second bonding pads via wires, underfill material filling the gap between the substrate and the bottom die, an underfill dam surrounding the bonding pads to restrict diffusion, a mold covering elements on the substrate surface, and solder balls on the opposite surface of the substrate.
- The package includes a substrate with two dies connected to bonding pads.
- Underfill material is used to fill the gap between the substrate and the bottom die.
- An underfill dam restricts the diffusion of the underfill material.
- A mold covers elements on the substrate surface.
- Solder balls are present on the opposite surface of the substrate.
Potential Applications: - This technology can be used in various semiconductor devices such as microprocessors, memory chips, and sensors. - It can also be applied in automotive electronics, consumer electronics, and industrial equipment.
Problems Solved: - Prevents diffusion of underfill material which can cause electrical issues. - Ensures secure electrical connections between the dies and bonding pads. - Protects the semiconductor components from external elements.
Benefits: - Enhanced reliability and durability of semiconductor packages. - Improved electrical performance and signal integrity. - Cost-effective manufacturing process.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Reliability This technology can be utilized in the production of high-performance electronic devices, leading to improved product quality and customer satisfaction. The market implications include increased demand for advanced semiconductor packaging solutions in various industries.
Questions about Semiconductor Packaging Technology: 1. How does the underfill dam restrict the diffusion of underfill material? The underfill dam surrounds the bonding pads to create a barrier that prevents the underfill material from spreading beyond the designated area, ensuring proper encapsulation and protection of the semiconductor components.
2. What are the key advantages of using solder balls on the substrate surface? Solder balls provide a reliable and robust connection between the semiconductor package and the external circuitry, enabling efficient signal transmission and power distribution.
Original Abstract Submitted
a semiconductor package includes: a substrate including a first surface and a second surface opposite the first surface, a bottom die electrically connected to first bonding pads on the first surface of the substrate; a top die on the bottom die and electrically connected to second bonding pads on the first surface of the substrate by wires, an underfill in a gap between the substrate and the bottom die, an underfill dam surrounding the first bonding pads and the second bonding pads on the first surface of the substrate and is configured to restrict diffusion of the underfill, a mold that at least partially covers elements on the first surface of the substrate, and a plurality of solder balls on the second surface of the substrate. the second bond pads and a part of each of the wires bonded to the second bonding pads are immersed in the underfill.
