Intel corporation (20240339412). EMBEDDED INTERCONNECT BRIDGE WITH INDUCTOR FOR POWER DELIVERY simplified abstract
Contents
EMBEDDED INTERCONNECT BRIDGE WITH INDUCTOR FOR POWER DELIVERY
Organization Name
Inventor(s)
Brandon C. Marin of Gilbert AZ (US)
Kristof Darmawikarta of Chandler AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
EMBEDDED INTERCONNECT BRIDGE WITH INDUCTOR FOR POWER DELIVERY - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240339412 titled 'EMBEDDED INTERCONNECT BRIDGE WITH INDUCTOR FOR POWER DELIVERY
The abstract of the patent application describes an interconnect bridge that includes a substrate, a first trace on the substrate, a first layer with a magnetic material on the first trace, a second layer with an insulating material over the substrate, and a second trace embedded in the second layer.
- The interconnect bridge consists of a substrate, a first trace, a first layer with a magnetic material, a second layer with an insulating material, and a second trace.
- The first trace is located on the substrate, while the first layer with a magnetic material is on the first trace.
- The second layer, which contains an insulating material, is positioned over the substrate.
- A second trace is embedded within the second layer.
Potential Applications: - This technology could be used in electronic devices to improve signal transmission and connectivity. - It may find applications in the telecommunications industry for enhancing data transfer speeds. - The interconnect bridge could be utilized in the automotive sector for advanced vehicle communication systems.
Problems Solved: - Enhances signal transmission efficiency. - Improves connectivity between components. - Reduces electromagnetic interference.
Benefits: - Increased data transfer speeds. - Enhanced signal reliability. - Improved overall performance of electronic devices.
Commercial Applications: Title: Advanced Interconnect Bridge Technology for Enhanced Signal Transmission This technology can be commercialized for use in smartphones, computers, and other electronic devices to improve connectivity and signal transmission. It has the potential to revolutionize the telecommunications and automotive industries by offering faster and more reliable data transfer capabilities.
Questions about Interconnect Bridge Technology: 1. How does the magnetic material in the first layer enhance the performance of the interconnect bridge? 2. What are the potential challenges in implementing this technology in different electronic devices?
Original Abstract Submitted
embodiments disclosed herein include an interconnect bridge. in an embodiment, the interconnect bridge comprises a substrate, and a first trace on the substrate. in an embodiment, a first layer is on the first trace, where the first layer comprises a magnetic material. in an embodiment, a second layer is over the substrate, where the second layer comprises an insulating material. in an embodiment, a second trace is embedded in the second layer.
