Taiwan semiconductor manufacturing co., ltd. (20240331439). Semiconductor Device with Biofet and Biometric Sensors simplified abstract
Contents
Semiconductor Device with Biofet and Biometric Sensors
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Ching-Hui Lin of Taichung City 407 (TW)
Chen-Ren Cheng of Hsinchu (TW)
Fu-Chun Huang of Zhubei City (TW)
Semiconductor Device with Biofet and Biometric Sensors - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240331439 titled 'Semiconductor Device with Biofet and Biometric Sensors
Simplified Explanation: The patent application describes a semiconductor device that includes an array of bioFET sensors, a biometric fingerprint sensor, and a temperature sensor. The method of fabricating the semiconductor device involves forming various components on different sides of the semiconductor substrate.
- The semiconductor device has an array of bioFET sensors, a biometric fingerprint sensor, and a temperature sensor.
- The method of fabrication includes forming a gate electrode, channel region, and piezoelectric sensor region on different sides of the semiconductor substrate.
- A temperature sensing electrode is formed on the second side of the substrate during the fabrication process.
- Capture reagents are bound to a sensing well on the channel region for sensor functionality.
Potential Applications: 1. Biometric security systems 2. Medical devices for monitoring biological signals 3. Environmental monitoring systems
Problems Solved: 1. Enhanced security through biometric sensors 2. Improved accuracy in temperature sensing 3. Integration of multiple sensors in a single device
Benefits: 1. Increased security measures 2. Accurate temperature monitoring 3. Compact and efficient sensor integration
Commercial Applications: Title: "Multi-Sensor Semiconductor Device for Enhanced Security and Monitoring" This technology can be used in biometric security systems, medical devices, and environmental monitoring equipment. The market implications include improved data accuracy, enhanced security measures, and increased efficiency in monitoring systems.
Prior Art: Prior art related to this technology may include patents or research papers on semiconductor devices with integrated sensors, biometric security systems, and temperature sensing technologies.
Frequently Updated Research: Researchers may be exploring advancements in sensor technology, semiconductor fabrication techniques, and integration of multiple sensors for diverse applications.
Questions about Semiconductor Device with BioFET Sensors, Fingerprint Sensor, and Temperature Sensor: 1. How does the integration of multiple sensors in a semiconductor device enhance its functionality? 2. What are the potential challenges in fabricating a semiconductor device with bioFET sensors and a biometric fingerprint sensor?
Original Abstract Submitted
the structure of a semiconductor device with an array of biofet sensors, a biometric fingerprint sensor, and a temperature sensor and a method of fabricating the semiconductor device are disclosed. a method for fabricating the semiconductor device includes forming a gate electrode on a first side of a semiconductor substrate, forming a channel region between source and drain regions within the semiconductor substrate, and forming a piezoelectric sensor region on a second side of the semiconductor substrate. the second side is substantially parallel and opposite to the first side. the method further includes forming a temperature sensing electrode on the second side during the forming of the piezoelectric sensor region, forming a sensing well on the channel region, and binding capture reagents on the sensing well.
