Taiwan semiconductor manufacturing co., ltd. (20240329533). SILVER PATTERNING AND INTERCONNECT PROCESSES simplified abstract
Contents
SILVER PATTERNING AND INTERCONNECT PROCESSES
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Kuosheng Chuang of Hsinchu (TW)
SILVER PATTERNING AND INTERCONNECT PROCESSES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240329533 titled 'SILVER PATTERNING AND INTERCONNECT PROCESSES
The method described in the patent application involves depositing a hard mask layer over a substrate, followed by depositing a silver precursor layer over the hard mask layer. Portions of the silver precursor layer are then exposed to radiation, causing a reduction of silver ions in the irradiated portions. Non-irradiated portions of the silver precursor layer are subsequently removed, resulting in the formation of a plurality of silver seed structures.
- Deposition of a hard mask layer over a substrate
- Deposition of a silver precursor layer over the hard mask layer
- Exposure of portions of the silver precursor layer to radiation
- Reduction of silver ions in the irradiated portions
- Removal of non-irradiated portions to form silver seed structures
Potential Applications: - Semiconductor manufacturing - Nanotechnology - Electronics industry
Problems Solved: - Efficient formation of silver seed structures - Precise control over semiconductor structure fabrication
Benefits: - Improved semiconductor device performance - Enhanced manufacturing processes - Cost-effective production methods
Commercial Applications: Title: "Advanced Semiconductor Structure Fabrication Method" This technology could be used in the production of various semiconductor devices, leading to advancements in electronics, telecommunications, and other high-tech industries. The method offers a more efficient and precise way to create semiconductor structures, potentially revolutionizing the manufacturing process.
Questions about the technology: 1. How does the radiation exposure specifically impact the silver precursor layer? 2. What are the advantages of using silver seed structures in semiconductor fabrication?
Original Abstract Submitted
a method for forming a semiconductor structure is provided. the method includes depositing a hard mask layer over a substrate. the method further includes depositing a silver precursor layer over the hard mask layer. the method further includes exposing portions of the silver precursor layer to a radiation, the radiation causing a reduction of silver ions in the irradiated portions of the silver precursor layer. the method further includes removing non-irradiated portions of the silver precursor layer, resulting in a plurality of silver seed structures.
