Taiwan semiconductor manufacturing co., ltd. (20240329336). PHOTONIC DEVICE AND METHOD OF MANUFACTURE simplified abstract
Contents
PHOTONIC DEVICE AND METHOD OF MANUFACTURE
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Tung-Liang Shao of Hsinchu (TW)
Hsing-Kuo Hsia of Jhubei City (TW)
Chih-Wei Tseng of Hsinchu (TW)
PHOTONIC DEVICE AND METHOD OF MANUFACTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240329336 titled 'PHOTONIC DEVICE AND METHOD OF MANUFACTURE
The photonic device described in the abstract includes a complex photonic interconnect structure with multiple layers and films for manipulating light.
- The device has a first cladding layer, a waveguide, a second cladding layer, and a transparent material with tilted sidewalls and reflective films.
- Additionally, there is a light-receiving structure with a transparent protrusion and reflective films that overlap with the first reflective film.
- The design of the device allows for efficient transmission and reception of light signals.
Potential Applications:
- Optical communication systems
- Data centers
- Photonic integrated circuits
Problems Solved:
- Efficient light transmission and reception
- Minimization of signal loss
- Enhanced performance of photonic devices
Benefits:
- Improved signal quality
- Higher data transmission speeds
- Enhanced overall performance of photonic devices
Commercial Applications:
- Telecommunications industry
- Data center infrastructure providers
- Semiconductor companies
Questions about the Technology: 1. How does the tilted sidewall design of the transparent material improve light manipulation? 2. What are the advantages of using reflective films in the photonic device design?
Frequently Updated Research: Ongoing research in the field of photonics and integrated circuits may lead to further advancements in the design and performance of similar devices.
Original Abstract Submitted
in some embodiments, a photonic device includes a photonic interconnect structure that includes a first cladding layer; a waveguide over the first cladding layer; a second cladding layer disposed over the waveguide; a transparent material in the first cladding layer and the second cladding layer, the transparent material includes a first sidewall adjacent to the waveguide and a second sidewall tilted with respect to the first sidewall of the transparent material; and a first reflective film over the second sidewall of the transparent material. in some embodiments, the photonic device also includes a light-receiving structure that includes a transparent protrusion above the transparent material, the transparent protrusion including a first sidewall and a second sidewall opposite to the second sidewall of the transparent protrusion; and a second reflective film over the second sidewall of the transparent protrusion and horizontally overlapping the first reflective film.
