Samsung electronics co., ltd. (20240334588). ELECTRONIC DEVICE COMPRISING PLURALITY OF PRINTED CIRCUIT BOARDS simplified abstract
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ELECTRONIC DEVICE COMPRISING PLURALITY OF PRINTED CIRCUIT BOARDS
Organization Name
Inventor(s)
ELECTRONIC DEVICE COMPRISING PLURALITY OF PRINTED CIRCUIT BOARDS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240334588 titled 'ELECTRONIC DEVICE COMPRISING PLURALITY OF PRINTED CIRCUIT BOARDS
The abstract describes an electronic device with two circuit boards, electronic components, a heat dissipation device, and heat transfer members.
- The device includes a first circuit board and a second circuit board facing opposite directions.
- Electronic components are placed on the second circuit board, with a heat dissipation device on its first surface.
- A first heat transfer member transfers heat from one electronic component to the heat dissipation device.
- A second heat transfer member transfers heat from another electronic component to the first circuit board.
Potential Applications: - This technology could be used in electronic devices such as computers, smartphones, and servers to improve heat dissipation and overall performance. - It may find applications in industries where efficient cooling of electronic components is crucial, such as aerospace and automotive sectors.
Problems Solved: - Addresses the issue of heat buildup in electronic devices, which can lead to performance degradation and component failure. - Improves the overall reliability and longevity of electronic devices by effectively dissipating heat.
Benefits: - Enhances the performance and reliability of electronic devices. - Increases the lifespan of electronic components. - Improves overall user experience by preventing overheating issues.
Commercial Applications: - This technology could be valuable for electronics manufacturers looking to enhance the performance and reliability of their products. - It may have significant implications in the consumer electronics market, where heat management is a critical factor in product design.
Questions about the technology: 1. How does the heat dissipation device improve the performance of electronic components? 2. What are the potential cost implications of implementing this technology in electronic devices?
Original Abstract Submitted
an electronic device according to an embodiment of the disclosure may include: a first circuit board; a second circuit board with a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction and facing the first circuit board; a first electronic component disposed between the first circuit board and the second surface of the second circuit board, and disposed in a first area of the second circuit board; a second electronic component disposed in a second area of the second circuit board; a heat dissipation device comprising a thermally conductive material disposed on the first surface of the second circuit board; a first heat transfer member comprising a thermally conductive material configured to transfer heat from the first electronic component to the heat dissipation device; and a second heat transfer member comprising a thermally conductive material configured to transfer heat from the second electronic component to the first circuit board.
