Samsung electronics co., ltd. (20240332270). SEMICONDUCTOR PACKAGE WITH DECOUPLING CAPACITOR AND METHOD FOR MANUFACTURING THE SAME simplified abstract
Contents
SEMICONDUCTOR PACKAGE WITH DECOUPLING CAPACITOR AND METHOD FOR MANUFACTURING THE SAME
Organization Name
Inventor(s)
Kyung Don Mun of Suwon-si (KR)
Kyoung Lim Suk of Suwon-si (KR)
SEMICONDUCTOR PACKAGE WITH DECOUPLING CAPACITOR AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240332270 titled 'SEMICONDUCTOR PACKAGE WITH DECOUPLING CAPACITOR AND METHOD FOR MANUFACTURING THE SAME
The present disclosure pertains to semiconductor packages and methods for manufacturing semiconductor packages. An example semiconductor package includes a top die, first and second bottom dies attached on a lower surface of the top die and being apart from each other by a preset distance, and at least one decoupling capacitor connected to the lower surface of the top die between the first bottom die and the second bottom die. The top die, the first bottom die, and the second bottom die are chiplets.
- Top die, first bottom die, and second bottom die are chiplets
- Decoupling capacitor connected to the lower surface of the top die
- Chiplets are attached on a lower surface of the top die
- First and second bottom dies are apart from each other by a preset distance
- Example of a semiconductor package
Potential Applications: - Semiconductor industry - Electronics manufacturing - Integrated circuits
Problems Solved: - Efficient packaging of semiconductor components - Improved performance and reliability of semiconductor devices
Benefits: - Enhanced functionality of semiconductor packages - Increased efficiency in manufacturing processes - Improved overall performance of electronic devices
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be utilized in various commercial applications such as: - Consumer electronics - Telecommunications - Automotive industry
Questions about Semiconductor Packages: 1. How does the use of chiplets in semiconductor packages improve performance? Chiplets in semiconductor packages allow for more efficient distribution of components, leading to enhanced functionality and performance.
2. What are the advantages of having decoupling capacitors in semiconductor packages? Decoupling capacitors help to reduce noise and improve signal integrity in semiconductor packages, resulting in better overall performance.
Original Abstract Submitted
the present disclosure relates to semiconductor packages and methods for manufacturing semiconductor packages. an example semiconductor package includes a top die, first and second bottom dies attached on a lower surface of the top die and being apart from each other by a preset distance, and at least one decoupling capacitor connected to the lower surface of the top die between the first bottom die and the second bottom die. the top die, the first bottom die, and the second bottom die are chiplets.
