Samsung electronics co., ltd. (20240332268). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
KYOUNG LIM Suk of Suwon-si (KR)
SEOKHYUN Lee of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240332268 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Simplified Explanation: The method described in the patent application involves fabricating a semiconductor package by providing a semiconductor chip, forming a redistribution substrate, and then fabricating a package with the semiconductor chip placed on the redistribution substrate.
- The process of forming the redistribution substrate includes creating a first insulating layer on a substrate, forming a first opening in the insulating layer, creating a first redistribution pattern within the opening, adding a second insulating layer to cover the first redistribution pattern, and performing a planarization process to expose the first redistribution pattern.
Key Features and Innovation:
- Fabrication of a semiconductor package with a redistribution substrate.
- Integration of multiple insulating layers and redistribution patterns.
- Planarization process for exposing redistribution patterns.
Potential Applications: The technology can be used in the manufacturing of various semiconductor devices, such as microprocessors, memory chips, and sensors.
Problems Solved: The method addresses the need for efficient and reliable packaging of semiconductor chips with redistribution substrates.
Benefits:
- Improved performance and reliability of semiconductor packages.
- Enhanced integration of components in a compact space.
- Cost-effective manufacturing process.
Commercial Applications: The technology can be applied in the semiconductor industry for producing advanced electronic devices with higher functionality and performance.
Questions about Semiconductor Packaging: 1. How does the planarization process contribute to the overall quality of the semiconductor package? 2. What are the advantages of using a redistribution substrate in semiconductor packaging?
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Original Abstract Submitted
a method of fabricating a semiconductor package includes providing a semiconductor chip, forming a redistribution substrate, and fabricating a package including the semiconductor chip disposed on the redistribution substrate. the forming of the redistribution substrate may include forming a first insulating layer on a substrate, the first insulating layer having a first opening formed therein, forming an integrally formed first redistribution pattern in the first opening and on the first insulating layer, forming a second insulating layer on the first insulating layer to cover the first redistribution pattern, and performing a planarization process on the second insulating layer to expose the first redistribution pattern.
