Samsung electronics co., ltd. (20240332253). SYSTEM ON CHIP INCLUDING INPUT AND OUTPUT CIRCUIT AND SEMICONDUCTOR DEVICE INCLUDING THE SAME simplified abstract
Contents
SYSTEM ON CHIP INCLUDING INPUT AND OUTPUT CIRCUIT AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
Organization Name
Inventor(s)
KWANYEOB Chae of Suwon-si (KR)
SYSTEM ON CHIP INCLUDING INPUT AND OUTPUT CIRCUIT AND SEMICONDUCTOR DEVICE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240332253 titled 'SYSTEM ON CHIP INCLUDING INPUT AND OUTPUT CIRCUIT AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
The abstract of the patent application describes a system on a chip that includes a processor and an input and output circuit with multiple elements connected to the processor. These elements are at varying distances from the processor and are connected through different electrical paths.
- The system on a chip includes a processor and an input and output circuit.
- The input and output circuit consists of multiple elements connected to the processor.
- The elements are positioned at different distances from the processor.
- Each element is connected to the processor through specific electrical paths.
- The design allows for efficient communication between the processor and the input and output elements.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and IoT devices. - It can also be applied in embedded systems, automotive electronics, and industrial automation.
Problems Solved: - Enables efficient data transfer between the processor and input/output elements. - Optimizes the layout of components on a chip for better performance.
Benefits: - Improved overall performance of electronic devices. - Enhanced communication between the processor and input/output elements. - Space-saving design for compact electronic devices.
Commercial Applications: Title: "Advanced System on Chip Technology for Enhanced Device Performance" This technology can be utilized in the development of next-generation smartphones, tablets, IoT devices, and other consumer electronics. It can also be integrated into automotive systems, industrial automation, and embedded devices to enhance their performance and efficiency.
Questions about the technology: 1. How does the varying distance of input and output elements from the processor impact the overall performance of the system on a chip? 2. What are the specific advantages of using different electrical paths to connect the elements to the processor in terms of data transfer speed and efficiency?
Original Abstract Submitted
a system on chip includes a processor and an input and output circuit including a plurality of input and output elements connected to the processor, wherein the plurality of input and output elements includes: a first input and output element spaced apart from the processor by a first distance; and a second input and output element spaced apart from the processor by a second distance, greater than the first distance, and connected to the processor by a first electrical path extending through a first region of the first input and output element, and wherein the first input and output element is connected to the processor by at least one first terminal provided in a second region that is separate from the first region.
