Samsung electronics co., ltd. (20240332245). DEVICE AND METHOD FOR BONDING SEMICONDUCTOR CHIP simplified abstract
Contents
DEVICE AND METHOD FOR BONDING SEMICONDUCTOR CHIP
Organization Name
Inventor(s)
Woon Chun Kim of Suwon-si (KR)
DEVICE AND METHOD FOR BONDING SEMICONDUCTOR CHIP - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240332245 titled 'DEVICE AND METHOD FOR BONDING SEMICONDUCTOR CHIP
The present disclosure pertains to a semiconductor chip bonding device and a semiconductor chip bonding method. The device bonds semiconductor chips on a substrate using a bonding head, a substrate support, a dam member, and a gas blower.
- The semiconductor chip bonding device includes a bonding head that is positioned on the semiconductor chip.
- A substrate support is located below the substrate to provide stability during the bonding process.
- A dam member surrounds the edge of the bonding head and contacts the upper side of the substrate to contain the bonding area.
- A gas blower is spaced and positioned on the substrate support to supply gas to the substrate, aiding in the bonding process.
Potential Applications: - Semiconductor manufacturing industry - Electronics assembly processes - Research and development in microelectronics
Problems Solved: - Ensures precise and secure bonding of semiconductor chips - Improves efficiency and accuracy in chip bonding processes
Benefits: - Enhanced reliability of semiconductor devices - Increased productivity in chip bonding operations - Cost-effective solution for semiconductor manufacturing
Commercial Applications: Title: Semiconductor Chip Bonding Device for Efficient Manufacturing Processes This technology can be utilized in semiconductor fabrication facilities, electronics manufacturing plants, and research institutions to streamline chip bonding processes and improve overall production efficiency.
Questions about Semiconductor Chip Bonding Device: 1. How does the dam member contribute to the effectiveness of the bonding process? The dam member surrounds the edge of the bonding head and contacts the upper side of the substrate to contain the bonding area, ensuring precise and secure bonding of semiconductor chips.
2. What role does the gas blower play in the semiconductor chip bonding device? The gas blower is spaced and positioned on the substrate support to supply gas to the substrate, aiding in the bonding process by creating a controlled environment for the bonding operation.
Original Abstract Submitted
the present disclosure relates to a semiconductor chip bonding device and a semiconductor chip bonding method using the same, the semiconductor chip bonding device bonds semiconductor chips on a substrate, and includes a bonding head disposed on the semiconductor chip; a substrate support disposed below the substrate; a dam member for surrounding an edge of the bonding head and contacting an upper side of the substrate; and a gas blower spaced and disposed on the substrate support, disposed between the bonding head and the dam member, and supplying gas to the substrate direction.
