Samsung electronics co., ltd. (20240332228). SEMICONDUCTOR DEVICES HAVING UPPER CONDUCTIVE PATTERNS AND SEMICONDUCTOR PACKAGES HAVING THE SAME simplified abstract
Contents
SEMICONDUCTOR DEVICES HAVING UPPER CONDUCTIVE PATTERNS AND SEMICONDUCTOR PACKAGES HAVING THE SAME
Organization Name
Inventor(s)
Joongwon Shin of Suwon-si (KR)
SEMICONDUCTOR DEVICES HAVING UPPER CONDUCTIVE PATTERNS AND SEMICONDUCTOR PACKAGES HAVING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240332228 titled 'SEMICONDUCTOR DEVICES HAVING UPPER CONDUCTIVE PATTERNS AND SEMICONDUCTOR PACKAGES HAVING THE SAME
The semiconductor device described in the patent application consists of various layers and patterns on a semiconductor substrate to enhance its functionality and performance.
- Lower conductive patterns are embedded within an insulating structure on the semiconductor substrate.
- Upper conductive patterns are positioned on top of the insulating structure.
- Conductive vias within the insulating structure connect the upper and lower conductive patterns.
- A protective layer covers the insulating structure and upper conductive patterns for added durability.
- An etch stop layer is placed over the protective layer to prevent unwanted etching.
- A first passivation layer is applied on specific areas of the etch stop layer between the upper conductive patterns.
- An upper passivation layer is then added on top of the first passivation layer for further protection.
Potential Applications: - This technology can be utilized in the manufacturing of advanced semiconductor devices for various electronic applications. - It can improve the performance and reliability of integrated circuits and microprocessors.
Problems Solved: - Enhances the connectivity and efficiency of semiconductor devices. - Provides additional protection against external elements and potential damage.
Benefits: - Increased functionality and performance of semiconductor devices. - Enhanced durability and longevity of integrated circuits. - Improved overall quality and reliability of electronic products.
Commercial Applications: - This technology can be applied in the production of smartphones, computers, and other consumer electronics. - It can also be used in automotive electronics, industrial machinery, and telecommunications equipment.
Questions about the technology: 1. How does the protective layer contribute to the overall durability of the semiconductor device? 2. What are the specific advantages of using conductive vias in connecting the upper and lower conductive patterns?
Original Abstract Submitted
a semiconductor device includes an insulating structure on a semiconductor substrate, lower conductive patterns in the insulating structure, upper conductive patterns on the insulating structure, conductive vias in the insulating structure and connecting at least one of the upper conductive patterns to at least one of the lower conductive patterns, a protective layer covering the insulating structure and the upper conductive patterns, an etch stop layer covering the protective layer, a first passivation layer on portions of the etch stop layer between the upper conductive patterns, and an upper passivation layer on the first passivation layer.
