Samsung electronics co., ltd. (20240332198). SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
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SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
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SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240332198 titled 'SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
The semiconductor device and semiconductor package described in the abstract consist of a lower semiconductor chip with a lower through-electrode, an interposer mounted on the lower chip, and an upper semiconductor chip connected to the interposer through-electrode.
- Lower semiconductor chip with a lower through-electrode
- Interposer with an interposer substrate
- Plurality of interposer through-electrodes connected to the lower through-electrode
- At least one capacitor in the interposer substrate connected to an interposer through-electrode
- Upper semiconductor chip mounted on the interposer and connected to the interposer through-electrode
Potential Applications: - Advanced electronic devices - High-performance computing systems - Communication equipment
Problems Solved: - Enhanced electrical connectivity - Improved signal transmission - Increased efficiency in semiconductor packaging
Benefits: - Higher performance capabilities - Improved reliability and durability - Enhanced overall functionality
Commercial Applications: Title: "Innovative Semiconductor Packaging for High-Performance Electronics" This technology can be utilized in various industries such as telecommunications, automotive, and consumer electronics for advanced product development and improved performance.
Questions about the technology: 1. How does the integration of an interposer improve the overall functionality of the semiconductor device? 2. What are the specific advantages of having capacitors in the interposer substrate for semiconductor packaging?
Original Abstract Submitted
a semiconductor device and semiconductor package, the device including a lower semiconductor chip including a lower through-electrode; an interposer mounted on the lower semiconductor chip, the interposer including an interposer substrate; a plurality of interposer through-electrodes penetrating through at least a portion of the interposer substrate in a vertical direction and electrically connected to the lower through-electrode; and at least one capacitor in the interposer substrate and electrically connected to at least one interposer through-electrode of the plurality of interposer through-electrodes; and an upper semiconductor chip mounted on the interposer and electrically connected to the interposer through-electrode.
