Samsung electronics co., ltd. (20240332157). SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE simplified abstract
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SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE
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SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240332157 titled 'SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE
The semiconductor package described in the patent application includes a redistribution structure with multiple redistribution layers within an insulating layer. A recess on the upper surface of the insulating layer exposes a portion of the uppermost redistribution layer. A pad structure is located at the bottom and inner wall of the recess, creating a cavity that is open upwardly. A semiconductor chip on the redistribution structure's upper surface has a connection terminal linked to the redistribution layers. A connection bump in the cavity connects the chip's terminal to the pad structure. The chip is covered by an encapsulant.
- Insulating layer with redistribution layers
- Recess exposing uppermost redistribution layer
- Pad structure in recess creating a cavity
- Semiconductor chip with connection terminal
- Connection bump linking chip terminal to pad structure
- Encapsulant covering semiconductor chip
Potential Applications: - Semiconductor packaging industry - Electronic devices requiring compact and efficient packaging
Problems Solved: - Efficient electrical connections in semiconductor packages - Space-saving design for electronic devices
Benefits: - Improved electrical connectivity - Compact and efficient semiconductor packaging - Enhanced reliability and performance of electronic devices
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Electronics Industry This technology can be utilized in various electronic devices such as smartphones, tablets, and computers, enhancing their performance and reliability. The compact design also allows for smaller and more efficient electronic products, appealing to consumers looking for high-performance devices.
Questions about Semiconductor Packaging Technology: 1. How does this technology improve the efficiency of electrical connections in semiconductor packages? 2. What are the potential applications of this advanced semiconductor packaging technology in the electronics industry?
Original Abstract Submitted
a semiconductor package includes a redistribution structure including an insulating layer. a plurality of redistribution layers are disposed within the insulating layer. a recess extends from an upper surface of the insulating layer and exposes at least a portion of a first uppermost redistribution layer. a first pad structure is disposed on a bottom and an inner wall of the recess. the first pad structure defines a cavity that is open upwardly. a semiconductor chip is disposed on the upper surface of the redistribution structure and includes a connection terminal electrically connected to the plurality of redistribution layers. a connection bump is disposed within the cavity and electrically connects the connection terminal of the semiconductor chip to the first pad structure of the redistribution structure. an encapsulant covers at least a portion of the semiconductor chip.
