Samsung electronics co., ltd. (20240331981). SHOWERHEAD, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME simplified abstract
SHOWERHEAD, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME
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SHOWERHEAD, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240331981 titled 'SHOWERHEAD, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME
The present disclosure pertains to showerheads, substrate processing apparatuses, and semiconductor fabrication methods. One example showerhead includes an inner plate and an outer plate combined with the inner plate, surrounding it. The inner plate consists of a disk-shaped central member with a gas hole extending in a first direction, and a ring-shaped first coupling member outside the central member. The outer plate comprises an outer ring body and a ring-shaped second coupling member inside the outer ring body. The first coupling member's bottom surface contacts the top surface of the second coupling member. There is a difference in angles between the first direction and the outer surface of the first coupling member and the inner surface of the outer ring body.
- The showerhead design includes an inner plate with a central member and a first coupling member, along with an outer plate with an outer ring body and a second coupling member.
- The inner and outer plates are combined to create a showerhead structure for substrate processing apparatuses in semiconductor fabrication.
- The unique angles between the inner and outer surfaces of the coupling members optimize gas flow and distribution within the showerhead.
- This innovation aims to improve the efficiency and effectiveness of gas delivery in substrate processing, leading to enhanced semiconductor fabrication processes.
- The design of the showerhead allows for precise control and uniform distribution of gases, crucial for high-quality semiconductor manufacturing.
Potential Applications: This technology can be applied in semiconductor fabrication processes, specifically in substrate processing apparatuses where precise gas distribution is essential.
Problems Solved: The design addresses issues related to gas flow control and distribution uniformity in showerheads used for semiconductor fabrication.
Benefits: Enhanced gas delivery efficiency, improved substrate processing quality, and increased semiconductor manufacturing productivity.
Commercial Applications: Optimized gas distribution in substrate processing can lead to higher yields and improved quality in semiconductor manufacturing processes, benefiting companies in the semiconductor industry.
Questions about the technology: 1. How does the unique design of the showerhead improve gas distribution in semiconductor fabrication processes? 2. What specific challenges in gas flow control does this innovation address in substrate processing?
Original Abstract Submitted
the present disclosure relates to showerheads, substrate processing apparatuses, and semiconductor fabrication methods. one example showerhead comprises an inner plate, and an outer plate combined with the inner plate and surrounding the inner plate. the inner plate includes a disk-shaped central member that comprises a gas hole extending in a first direction, and a ring-shaped first coupling member outside the central member and surrounding the central member. the outer plate includes an outer ring body and a ring-shaped second coupling member inside the outer ring body. a bottom surface of the first coupling member is in contact with a top surface of the second coupling member. a first angle between the first direction and an outer surface of the first coupling member is different from a second angle between the first direction and an inner surface of the outer ring body.
