Intel corporation (20240334600). PRINTED CIRCUIT BOARDS INCLUDING DIRECT ROUTING FROM INTEGRATED CIRCUIT PACKAGES simplified abstract
Contents
PRINTED CIRCUIT BOARDS INCLUDING DIRECT ROUTING FROM INTEGRATED CIRCUIT PACKAGES
Organization Name
Inventor(s)
Rijo Kizhakkedathu Avarachan of Bayan Lepas (MY)
Eng Huat Goh of Ayer Itam (MY)
PRINTED CIRCUIT BOARDS INCLUDING DIRECT ROUTING FROM INTEGRATED CIRCUIT PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240334600 titled 'PRINTED CIRCUIT BOARDS INCLUDING DIRECT ROUTING FROM INTEGRATED CIRCUIT PACKAGES
Simplified Explanation: This patent application discloses printed circuit boards with direct routing from integrated circuit packages. The substrate described includes contact pad arrays for receiving an integrated circuit package and a memory die, with interconnections between the two arrays.
Key Features and Innovation:
- Printed circuit boards with direct routing from integrated circuit packages
- Substrate design with matching contact pad arrays for integrated circuit packages and memory dies
- Layer with interconnections between the contact pad arrays
Potential Applications: This technology can be used in various electronic devices that require efficient routing of signals between integrated circuit packages and memory dies.
Problems Solved: This technology addresses the need for improved signal routing and connectivity in printed circuit boards, especially in devices with integrated circuit packages and memory dies.
Benefits:
- Enhanced signal routing efficiency
- Improved connectivity between integrated circuit packages and memory dies
- Simplified design for printed circuit boards
Commercial Applications: The technology can be applied in the manufacturing of smartphones, tablets, laptops, and other electronic devices that require high-performance printed circuit boards.
Prior Art: Researchers can explore prior patents related to printed circuit board design, signal routing, and interconnection technologies to understand the existing knowledge in this field.
Frequently Updated Research: Researchers may find updated studies on signal routing techniques, integrated circuit packaging, and memory die connectivity relevant to this technology.
Questions about Printed Circuit Boards with Direct Routing: 1. What are the key advantages of direct routing from integrated circuit packages in printed circuit boards? 2. How does this technology improve signal integrity in electronic devices?
Original Abstract Submitted
printed circuit boards including direct routing from integrated circuit packages are disclosed. an example substrate disclosed herein including a first contact pad array to receive an integrated circuit package, a second contact pad array to receive a memory die, the first contact pad array having a matching arrangement as the second contact pad array, and a layer including a plurality of interconnections extending between the first contact pad array and the second contact pad array.
