Intel corporation (20240332322). INDUCTORLESS CIRCUITS FOR CURRENT-VOLTAGE CONTROL AND REGULATION IN GLASS CORE simplified abstract
Contents
INDUCTORLESS CIRCUITS FOR CURRENT-VOLTAGE CONTROL AND REGULATION IN GLASS CORE
Organization Name
Inventor(s)
Srinivasan Raman of Chandler AZ (US)
Brandon C. Marin of Gilbert AZ (US)
Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)
Suddhasattwa Nad of Chandler AZ (US)
Kripa Chauhan of Gilbert AZ (US)
INDUCTORLESS CIRCUITS FOR CURRENT-VOLTAGE CONTROL AND REGULATION IN GLASS CORE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240332322 titled 'INDUCTORLESS CIRCUITS FOR CURRENT-VOLTAGE CONTROL AND REGULATION IN GLASS CORE
Simplified Explanation: The patent application describes an electronic device with a glass core layer containing a regulator circuit, with some components embedded in the glass and others formed on its surface.
Key Features and Innovation:
- Electronic device with glass core layer
- Regulator circuit embedded in glass core layer
- Circuit components formed on surface of glass core layer
Potential Applications: This technology could be used in various electronic devices requiring precise regulation of power, such as smartphones, tablets, and wearables.
Problems Solved: This technology addresses the need for efficient power regulation in electronic devices while also providing a compact and durable solution.
Benefits:
- Precise power regulation
- Compact design
- Durable construction
Commercial Applications: Potential commercial applications include consumer electronics, medical devices, and industrial equipment where reliable power regulation is essential for optimal performance.
Questions about Glass Core Layer Technology: 1. How does embedding circuit components in a glass core layer benefit electronic devices? 2. What are the advantages of having a regulator circuit with components formed on the surface of the glass core layer?
Frequently Updated Research: There may be ongoing research in the field of glass core layer technology for electronic devices, focusing on improving efficiency and performance.
Original Abstract Submitted
an electronic device and associated methods are disclosed. in one example, the electronic device includes an electronic package substrate including a glass core layer and a regulator circuit. a first portion of the circuit components of the regulator circuit is embedded in the glass core layer and a second portion of the circuit components of the regulator circuit is formed on a surface of the glass core layer.
- Intel corporation
- Srinivasan Raman of Chandler AZ (US)
- Brandon C. Marin of Gilbert AZ (US)
- Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)
- Gang Duan of Chandler AZ (US)
- Suddhasattwa Nad of Chandler AZ (US)
- Kripa Chauhan of Gilbert AZ (US)
- H01L27/13
- H01L21/84
- H01L23/482
- H01L25/16
- H01L25/18
- H01L29/66
- H01L29/772
- CPC H01L27/13