Intel corporation (20240332251). DUMMY SILICON STIFFENING MECHANISM FOR MODULE WARPAGE MITIGATION simplified abstract
Contents
DUMMY SILICON STIFFENING MECHANISM FOR MODULE WARPAGE MITIGATION
Organization Name
Inventor(s)
Kavitha Nagarajan of Bangalore (IN)
Stephan Stoeckl of Schwandorf (DE)
Eng Huat Goh of Ayer Itam (MY)
DUMMY SILICON STIFFENING MECHANISM FOR MODULE WARPAGE MITIGATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240332251 titled 'DUMMY SILICON STIFFENING MECHANISM FOR MODULE WARPAGE MITIGATION
The abstract of this patent application describes electronic packages, including a substrate with first and second surfaces, multiple dies coupled to the first surface, and a bump field on the second surface with a voided region towards the center of the substrate where a second die is placed.
- Simplified Explanation:
- The patent application is about electronic packages with a substrate, dies, and bump fields. - The substrate has two surfaces, with dies attached to one surface and a bump field on the other. - A voided region in the bump field allows for placement of a second die.
- Key Features and Innovation:
- Electronic package design with a substrate, dies, and bump fields. - Voided region in the bump field for accommodating a second die.
- Potential Applications:
- Semiconductor industry for electronic packaging. - Consumer electronics for compact and efficient devices.
- Problems Solved:
- Efficient use of space in electronic packages. - Improved thermal management in electronic devices.
- Benefits:
- Higher component density in electronic packages. - Enhanced performance and reliability of electronic devices.
- Commercial Applications:
- Semiconductor manufacturing for electronic components. - Consumer electronics for smartphones, tablets, and other devices.
- Questions about Electronic Packages:
1. How does the voided region in the bump field impact the overall performance of the electronic package? 2. What are the specific advantages of having multiple dies in a single electronic package?
- Frequently Updated Research:
- Stay updated on advancements in electronic packaging technology for potential improvements in design and performance.
Original Abstract Submitted
embodiments disclosed herein include electronic packages. in an embodiment, the electronic package comprises a substrate with a first surface and a second surface opposite from the first surface. in an embodiment, a plurality of first dies are coupled to the first surface of the substrate, and a bump field is on the second surface of the substrate. in an embodiment, the bump field comprises a voided region towards a center of the substrate. in an embodiment, a second die is coupled to the second surface of the substrate, where the second die is provided in the voided region.
